AMD Xilinx
XCS30XL-3BG256C
XCS30XL-3BG256C ECAD Model
XCS30XL-3BG256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 |
XCS30XL-3BG256C Datasheet Download
XCS30XL-3BG256C Overview
The XCS30XL-3BG256C chip model is the latest offering from the renowned semiconductor manufacturer Xilinx. This model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing applications. It has been designed to use the HDL (Hardware Description Language) to program the chip and make it suitable for a wide range of applications.
The XCS30XL-3BG256C chip model is a great choice for projects that require high performance and low power consumption. It has a low power consumption of only 4.5W, which makes it an ideal choice for applications that require long-term operation. It also has a high-speed clock frequency of up to 500MHz, which makes it suitable for high-performance digital signal processing. Additionally, it features up to 256KB of on-chip memory, which makes it an ideal choice for embedded processing and image processing.
The XCS30XL-3BG256C chip model is expected to be in high demand in the near future, as it is a great choice for applications that require high performance and low power consumption. It is also expected to be used in advanced communication systems, as its high-speed clock frequency and on-chip memory make it suitable for such applications.
The original design intention of the XCS30XL-3BG256C chip model was to provide a low-power solution for high-performance digital signal processing and embedded processing applications. Additionally, it was designed to be easily upgradable, so that it can be used for more advanced applications in the future. This makes it a great choice for projects that require a high level of performance and flexibility.
The XCS30XL-3BG256C chip model is a great choice for applications that require high performance and low power consumption. It is also expected to be in high demand in the near future, as it is suitable for advanced communication systems. Additionally, it was designed to be easily upgradable, so that it can be used for more advanced applications in the future. With its great performance, low power consumption, and upgradability, the XCS30XL-3BG256C chip model is sure to be a great choice for many projects in the near future.
You May Also Be Interested In
1,271 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||