AMD Xilinx
XCS30-4TQG144C
XCS30-4TQG144C ECAD Model
XCS30-4TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 30000 | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30-4TQG144C Datasheet Download
XCS30-4TQG144C Overview
The chip model XCS30-4TQG144C is a highly advanced semiconductor device that has been developed to meet the needs of modern technology. It has been designed to provide a wide range of features, including high-speed communication, memory storage, and data processing capabilities. The chip model has been designed to be used in a variety of applications, ranging from consumer electronics to industrial automation.
In terms of industry trends, the chip model XCS30-4TQG144C is expected to become increasingly popular in the future as its features become more widely adopted. It is likely that the chip model will become a popular choice for a variety of applications, ranging from consumer electronics to industrial automation. The chip model has the potential to revolutionize the way in which technology is used in the future.
When it comes to the future development of related industries, the chip model XCS30-4TQG144C will play a key role in the development of new technologies. It is likely that the chip model will be used in the development of advanced communication systems, as well as in the development of new intelligent robots. The chip model has the potential to revolutionize the way in which technology is used in the future, and it is likely that it will become increasingly popular in the future.
In order to use the chip model XCS30-4TQG144C effectively, it is important that the right technical personnel are employed. The chip model requires a high level of technical expertise in order to be used effectively, and it is important that the right personnel are employed in order to ensure that the chip model is used to its full potential. It is likely that the chip model will require a variety of technical skills, ranging from software engineering to electrical engineering, in order to be used effectively.
The chip model XCS30-4TQG144C is a highly advanced semiconductor device that has the potential to revolutionize the way in which technology is used in the future. It is expected to become increasingly popular in the future, and it is likely that the chip model will be used in the development of advanced communication systems, as well as in the development of new intelligent robots. In order to use the chip model XCS30-4TQG144C effectively, it is important that the right technical personnel are employed in order to ensure that the chip model is used to its full potential. The chip model has the potential to revolutionize the way in which technology is used in the future, and it is likely that it will become increasingly popular in the future.
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