AMD Xilinx
XCS30-3VQG100C
XCS30-3VQG100C ECAD Model
XCS30-3VQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 30000 | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30-3VQG100C Datasheet Download
XCS30-3VQG100C Overview
The chip model XCS30-3VQG100C is a versatile integrated circuit (IC) that is widely used in a variety of industries. It is designed to support the latest technologies and provide a high-performance, low-power solution for a variety of applications.
The XCS30-3VQG100C is a field-programmable gate array (FPGA) that is designed to be highly configurable and provide high performance. It is equipped with multiple digital signal processing (DSP) cores, which enable it to support a wide range of applications. It also features a wide range of I/O ports, which make it suitable for a variety of communication systems.
The XCS30-3VQG100C can be used in a variety of industries, including automotive, consumer electronics, industrial automation, and medical devices. It is designed to be highly reliable and provide a high level of performance. It is also designed to be easily upgradeable, allowing it to be used in future applications and technologies.
In terms of industry trends, the XCS30-3VQG100C is expected to be in high demand in the future. This is due to its versatility and ability to support a wide range of applications. It is also expected to be used in more advanced communication systems, as it is designed to be easily upgradeable.
The original design intention of the XCS30-3VQG100C was to provide a high-performance, low-power solution for a variety of applications. It is designed to be highly configurable and provide a high level of performance. It is also designed to be easily upgradeable, allowing it to be used in future applications and technologies.
Overall, the XCS30-3VQG100C is a versatile IC that is designed to provide a high-performance, low-power solution for a variety of applications. It is expected to be in high demand in the future, as it is designed to be easily upgradeable and support a wide range of applications. It is also expected to be used in more advanced communication systems, as it is designed to be easily upgradeable.
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3,666 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $24.2433 | $24.2433 |
| 10+ | $23.9827 | $239.8265 |
| 100+ | $22.6792 | $2,267.9247 |
| 1000+ | $21.3758 | $10,687.9210 |
| 10000+ | $19.5511 | $19,551.0750 |
| The price is for reference only, please refer to the actual quotation! | ||