AMD Xilinx
XCS30-3TQG144I
XCS30-3TQG144I ECAD Model
XCS30-3TQG144I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 30000 | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30-3TQG144I Datasheet Download
XCS30-3TQG144I Overview
The XCS30-3TQG144I chip model is a high-performance, low-power, and cost-effective solution for digital signal processing, embedded processing, and image processing applications. It utilizes an advanced architecture that combines the advantages of field-programmable gate arrays (FPGAs) with the power of a high-speed processor, enabling developers to create complex systems quickly and easily.
The XCS30-3TQG144I is designed with the intention of providing users with a high-performance, low-power, and cost-effective solution for their digital signal processing, embedded processing, and image processing needs. It is capable of handling complex tasks with ease, and is also capable of being upgraded in the future with additional features and capabilities.
The product description of the XCS30-3TQG144I chip model includes an advanced architecture that combines the advantages of FPGAs with the power of a high-speed processor. It is also capable of handling complex tasks, and requires the use of HDL language for programming. As far as actual case studies and precautions, the XCS30-3TQG144I chip model has been successfully used in a variety of advanced communication systems, such as wireless networks and satellite systems. When using the XCS30-3TQG144I chip model, it is important to take into account the power requirements of the system and to ensure that the system is designed with the appropriate power and cooling solutions. Additionally, it is important to ensure that the system is properly tested before deployment.
Overall, the XCS30-3TQG144I chip model is an excellent solution for digital signal processing, embedded processing, and image processing applications. It is capable of handling complex tasks with ease, and is also capable of being upgraded in the future with additional features and capabilities. It is important to take into account the power requirements of the system and to ensure that the system is designed with the appropriate power and cooling solutions. Additionally, it is important to ensure that the system is properly tested before deployment.
You May Also Be Interested In
2,736 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||