
AMD Xilinx
XCS30-3TQG144C
XCS30-3TQG144C ECAD Model
XCS30-3TQG144C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | MAXIMUM USABLE GATES 30000 | |
Clock Frequency-Max | 125 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS30-3TQG144C Datasheet Download
XCS30-3TQG144C Overview
The XCS30-3TQG144C chip model is a state-of-the-art product from Xilinx, a leading provider of programmable logic solutions. The chip is designed for high-performance digital signal processing, embedded processing, image processing and other applications that require the use of HDL language. It provides the user with the flexibility to design and implement their own system with the highest performance.
The XCS30-3TQG144C chip model offers a range of features to meet the demands of the most advanced applications. It has a high-performance 32-bit processor core, an integrated DSP, and advanced memory interfaces. The chip also offers a wide range of peripherals, including USB, Ethernet, and UART interfaces. Furthermore, the chip supports multiple external memory devices, such as SRAM, Flash, and DDR3.
The XCS30-3TQG144C chip model is suitable for a wide range of applications, including digital signal processing, embedded processing, image processing, and more. It is also suitable for use in high-performance computing, real-time control, and embedded systems. The chip can be used in a variety of applications, such as industrial automation, automotive, medical, and consumer electronics.
The industry trends of the chip model XCS30-3TQG144C and the future development of related industries depend on the technologies and applications that require the use of the chip. For example, the chip can be used in the development of autonomous vehicles, artificial intelligence, and machine learning. It is also suitable for use in the development of new technologies such as 5G networks, IoT, and cloud computing.
The product description and specific design requirements of the XCS30-3TQG144C chip model are available on the Xilinx website. The user can also find a wealth of resources, such as tutorials, reference designs, and application notes, to help them design their own system. Additionally, case studies and user feedback are available to provide the user with a better understanding of the chip and its capabilities.
When designing a system with the XCS30-3TQG144C chip model, it is important to consider the application environment and the specific design requirements. It is also important to consider the power consumption, temperature, and clock speed requirements of the system. Furthermore, it is important to ensure that the system is compatible with existing technologies, such as USB, Ethernet, and UART interfaces.
In conclusion, the XCS30-3TQG144C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It provides the user with the flexibility to design and implement their own system with the highest performance. The industry trends of the chip model and the future development of related industries depend on the technologies and applications that require the use of the chip. Finally, it is important to consider the application environment and the specific design requirements when designing a system with the XCS30-3TQG144C chip model.
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3,103 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $26.6850 | $26.6850 |
10+ | $26.3981 | $263.9811 |
100+ | $24.9634 | $2,496.3432 |
1000+ | $23.5288 | $11,764.3760 |
10000+ | $21.5202 | $21,520.2000 |
The price is for reference only, please refer to the actual quotation! |