
AMD Xilinx
XCS30-3PQG208I
XCS30-3PQG208I ECAD Model
XCS30-3PQG208I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | MAXIMUM USABLE GATES 30000 | |
Clock Frequency-Max | 125 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 208 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS30-3PQG208I Datasheet Download
XCS30-3PQG208I Overview
Chip model XCS30-3PQG208I is a high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other applications. This chip model uses a high-level hardware description language (HDL) to define the logic of the chip and is suitable for applications that require high-speed processing of digital signals.
The XCS30-3PQG208I is a powerful and flexible chip model that offers a range of features and capabilities. This chip model has a wide range of applications, including digital signal processing, embedded processing, image processing, and more. It is suitable for applications that require the use of HDL language, and its features and capabilities make it an ideal choice for many different types of projects.
The XCS30-3PQG208I chip model is part of a larger trend in the industry towards high-performance digital signal processing and embedded processing. This chip model is well-suited for applications that require high-speed processing of digital signals and is capable of handling complex tasks with ease. As technology advances, the XCS30-3PQG208I will continue to be a viable option for many projects.
When considering the XCS30-3PQG208I chip model, it is important to understand the product description and design requirements. The product description should include information on the features and capabilities of the chip model, as well as any specific design requirements. It is also important to consider the application environment and any new technologies that may be required to support the chip model.
In addition to understanding the product description and design requirements, it is also beneficial to review actual case studies and cautionary tales related to the XCS30-3PQG208I chip model. These case studies can provide valuable insights into the chip model's capabilities and limitations and can help inform the design process. By understanding the chip model and its capabilities, designers can make informed decisions and ensure that their projects are successful.
Overall, the XCS30-3PQG208I chip model is a powerful and flexible option for applications that require high-speed processing of digital signals. This chip model is well-suited for embedded processing and image processing and is capable of handling complex tasks with ease. When considering the product description and design requirements, it is important to review actual case studies and cautionary tales related to the XCS30-3PQG208I chip model. With the right design and understanding of the chip model's capabilities, the XCS30-3PQG208I can be an excellent choice for many projects.
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