
AMD Xilinx
XCS30-3PQG208C
XCS30-3PQG208C ECAD Model
XCS30-3PQG208C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | MAXIMUM USABLE GATES 30000 | |
Clock Frequency-Max | 125 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 208 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS30-3PQG208C Datasheet Download
XCS30-3PQG208C Overview
The chip model XCS30-3PQG208C is a cutting-edge product in the semiconductor industry that has been gaining traction in recent years. It is a cost-effective and power-efficient solution for various applications in the industrial, consumer, and automotive markets. This model is capable of supporting a wide range of technologies, making it a great choice for many applications.
The XCS30-3PQG208C chip model offers a variety of features that make it an attractive option for many users. It has a low power consumption rate, making it suitable for battery-operated devices. It also has a wide operating temperature range, making it suitable for a variety of environments. Additionally, its high-speed data processing capabilities make it ideal for applications that require fast data processing.
As the demand for chip models like the XCS30-3PQG208C increases, the need for new technologies to support it will also increase. This model is capable of supporting a variety of technologies, including artificial intelligence, machine learning, and computer vision. With the help of these technologies, the XCS30-3PQG208C can be used for a variety of applications, such as autonomous vehicles, robotics, and intelligent systems.
The XCS30-3PQG208C chip model can also be used in the development and popularization of future intelligent robots. This is because the model is capable of supporting a variety of technologies, including artificial intelligence, machine learning, and computer vision. These technologies are essential for the development of robots that can interact with their environment, learn from their experiences, and make decisions based on their observations.
In order to use the XCS30-3PQG208C chip model effectively, it is important to have the right technical talents. This includes engineers who are knowledgeable in the areas of artificial intelligence, machine learning, and computer vision. Additionally, it is important to have professionals who are familiar with the chip model and its capabilities. These professionals can help to ensure that the model is used in the most effective way possible.
The chip model XCS30-3PQG208C is a powerful and cost-effective solution for a variety of applications in the industrial, consumer, and automotive markets. With its support for a variety of technologies, it can be used for a variety of applications, including the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to have the right technical talents, such as engineers who are knowledgeable in the areas of artificial intelligence, machine learning, and computer vision. With the right professionals in place, the XCS30-3PQG208C chip model can be used to its full potential, allowing for the development and popularization of future intelligent robots.
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