XCS30-3PQG208C
XCS30-3PQG208C
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rohs

AMD Xilinx

XCS30-3PQG208C


XCS30-3PQG208C
F20-XCS30-3PQG208C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FQFP
FQFP

XCS30-3PQG208C ECAD Model


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XCS30-3PQG208C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 10000
Number of CLBs 576
Combinatorial Delay of a CLB-Max 1.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Additional Feature MAXIMUM USABLE GATES 30000
Clock Frequency-Max 125 MHz
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 208
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS30-3PQG208C Datasheet Download


XCS30-3PQG208C Overview



The chip model XCS30-3PQG208C is a cutting-edge product in the semiconductor industry that has been gaining traction in recent years. It is a cost-effective and power-efficient solution for various applications in the industrial, consumer, and automotive markets. This model is capable of supporting a wide range of technologies, making it a great choice for many applications.


The XCS30-3PQG208C chip model offers a variety of features that make it an attractive option for many users. It has a low power consumption rate, making it suitable for battery-operated devices. It also has a wide operating temperature range, making it suitable for a variety of environments. Additionally, its high-speed data processing capabilities make it ideal for applications that require fast data processing.


As the demand for chip models like the XCS30-3PQG208C increases, the need for new technologies to support it will also increase. This model is capable of supporting a variety of technologies, including artificial intelligence, machine learning, and computer vision. With the help of these technologies, the XCS30-3PQG208C can be used for a variety of applications, such as autonomous vehicles, robotics, and intelligent systems.


The XCS30-3PQG208C chip model can also be used in the development and popularization of future intelligent robots. This is because the model is capable of supporting a variety of technologies, including artificial intelligence, machine learning, and computer vision. These technologies are essential for the development of robots that can interact with their environment, learn from their experiences, and make decisions based on their observations.


In order to use the XCS30-3PQG208C chip model effectively, it is important to have the right technical talents. This includes engineers who are knowledgeable in the areas of artificial intelligence, machine learning, and computer vision. Additionally, it is important to have professionals who are familiar with the chip model and its capabilities. These professionals can help to ensure that the model is used in the most effective way possible.


The chip model XCS30-3PQG208C is a powerful and cost-effective solution for a variety of applications in the industrial, consumer, and automotive markets. With its support for a variety of technologies, it can be used for a variety of applications, including the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to have the right technical talents, such as engineers who are knowledgeable in the areas of artificial intelligence, machine learning, and computer vision. With the right professionals in place, the XCS30-3PQG208C chip model can be used to its full potential, allowing for the development and popularization of future intelligent robots.



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