XCS30-3PQ208I
XCS30-3PQ208I
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AMD Xilinx

XCS30-3PQ208I


XCS30-3PQ208I
F20-XCS30-3PQ208I
Active
IC FPGA 169 I/O 208QFP
208-PQFP (28x28)

XCS30-3PQ208I ECAD Model


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XCS30-3PQ208I Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®
Package Tray
Number of LABs/CLBs 576
Number of Logic Elements/Cells 1368
Total RAM Bits 18432
Number of I/O 169
Number of Gates 30000
Voltage - Supply 4.5V ~ 5.5V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)
Base Product Number XCS30

XCS30-3PQ208I Datasheet Download


XCS30-3PQ208I Overview



The XCS30-3PQ208I is a field programmable gate array (FPGA) chip model manufactured by Xilinx. It is a low-cost, high-performance FPGA with a range of features that make it suitable for a wide variety of applications.


The XCS30-3PQ208I features a 3.3V logic core, a high-speed transceiver, and a range of I/O options. It has a total of 208 logic cells, 4Kbits of RAM, and up to 4 clock resources. It also features an internal oscillator and a JTAG interface. The chip has a total power dissipation of 1.2W and an operating temperature range of -40°C to +85°C.


The XCS30-3PQ208I is ideal for applications such as embedded systems, communications, industrial automation, medical imaging, and automotive. It is well suited for applications that require low power, high speed, and flexibility. The chip can be used for a variety of tasks such as video processing, image processing, signal processing, and digital signal processing.


The XCS30-3PQ208I is an ideal choice for applications that require a low-cost, high-performance FPGA solution. Its wide range of features makes it suitable for a variety of applications, and its low power dissipation and wide operating temperature range make it an ideal choice for embedded systems.



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