AMD Xilinx
XCS30-3BGG256I
XCS30-3BGG256I ECAD Model
XCS30-3BGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 576 CLBS, 10000 GATES | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30-3BGG256I Datasheet Download
XCS30-3BGG256I Overview
The chip model XCS30-3BGG256I is a high-performance digital signal processor, embedded processor, and image processor. It is designed to provide superior performance for a variety of applications. It is also suitable for use in applications requiring the use of HDL language.
The chip model XCS30-3BGG256I offers several advantages. It is designed for high-performance digital signal processing and embedded processing, and its image processing capabilities are also up to par. It is also designed to be energy-efficient and able to handle complex tasks. Additionally, the model is easy to integrate into existing systems, and its programming language is compatible with HDL language.
The chip model XCS30-3BGG256I is expected to see increasing demand in the future as more applications require its capabilities. As the technology behind the model continues to advance, the opportunities for its use will expand. This could include applications in areas such as automotive, medical, and industrial automation.
In order to take full advantage of the chip model XCS30-3BGG256I, it is important to ensure that the application environment requires the support of new technologies. This could include technologies such as artificial intelligence, machine learning, and autonomous systems. By integrating these technologies into the application environment, the chip model XCS30-3BGG256I can be used to its fullest potential.
Overall, the chip model XCS30-3BGG256I is a powerful and versatile processor that can be used for a variety of applications. Its energy-efficiency and compatibility with HDL language make it a great choice for applications that require high-performance digital signal processing, embedded processing, and image processing. As the demand for its capabilities grows, it is important to ensure that the application environment requires the support of new technologies in order to take full advantage of the model.
You May Also Be Interested In
5,165 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $36.1255 | $36.1255 |
| 10+ | $35.7370 | $357.3703 |
| 100+ | $33.7948 | $3,379.4802 |
| 1000+ | $31.8526 | $15,926.2860 |
| 10000+ | $29.1335 | $29,133.4500 |
| The price is for reference only, please refer to the actual quotation! | ||