AMD Xilinx
XCS20XL-4VQ100Q
XCS20XL-4VQ100Q ECAD Model
XCS20XL-4VQ100Q Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 160 | |
| Number of Outputs | 160 | |
| Number of Logic Cells | 400 | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 400 CLBS, 7000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 20000 | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, TQFP100,.63SQ | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCS20XL-4VQ100Q Datasheet Download
XCS20XL-4VQ100Q Overview
The chip model XCS20XL-4VQ100Q is a powerful digital signal processing chip that is suitable for high-performance embedded processing, image processing, and other applications. It requires the use of HDL language to achieve its full potential. This chip model is increasingly being used in the industry due to its high performance and low power consumption.
As the chip model XCS20XL-4VQ100Q is becoming more widely used, the industry trends and future development of related industries will depend on the specific technologies that are needed. This chip model can be applied to the development and popularization of future intelligent robots, as it is capable of performing complex tasks with minimal power consumption. To use this model effectively, technical talents with knowledge in embedded systems, digital signal processing, and HDL language are needed.
The chip model XCS20XL-4VQ100Q is a great example of how technology is advancing to meet the needs of the industry. This chip model is capable of performing complex tasks while still maintaining a low power consumption, making it an ideal choice for applications that require high performance and low power consumption. By combining the power of this chip model with the knowledge of the right technical talents, the possibilities of future intelligent robots are limitless.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||