AMD Xilinx
XCS20XL-3VQG100C
XCS20XL-3VQG100C ECAD Model
XCS20XL-3VQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 400 CLBS, 7000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS20XL-3VQG100C Datasheet Download
XCS20XL-3VQG100C Overview
The XCS20XL-3VQG100C chip model is designed to provide advanced communication systems with a powerful and reliable solution. It is a low-power, high-performance, low-cost solution that can be used in a wide range of applications. The chip model is designed to meet specific design requirements and can be used in a variety of communication systems.
The XCS20XL-3VQG100C chip model is designed to provide advanced communication systems with a powerful and reliable solution. It is a low-power, high-performance, low-cost solution that can be used in a wide range of applications. The chip model is designed to meet specific design requirements and can be used in a variety of communication systems. It is designed to provide high-speed data transfer, low latency, and high reliability. It is also designed to be compatible with a range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth.
The original design intention of the XCS20XL-3VQG100C chip model was to provide a powerful and reliable solution for advanced communication systems. It is designed to be used in a variety of applications, ranging from high-speed data transfer, low latency, and high reliability to compatibility with a range of communication protocols. It is also designed to be flexible and easily upgradable, allowing for future upgrades and improvements.
The XCS20XL-3VQG100C chip model is also designed to be used in advanced communication systems and networks. It can be used in intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It can also be used in the era of fully intelligent systems, such as the Internet of Things (IoT). The chip model is also designed to be secure, allowing for end-to-end encryption and authentication.
The product description and specific design requirements of the XCS20XL-3VQG100C chip model should be carefully studied to ensure the best possible performance. Actual case studies and precautions should also be taken into account when using the chip model. For example, the chip model should be used in a temperature-controlled environment, and the chip should be tested regularly to ensure that it is functioning properly.
In conclusion, the XCS20XL-3VQG100C chip model is designed to provide advanced communication systems with a powerful and reliable solution. It is a low-power, high-performance, low-cost solution that can be used in a wide range of applications. The chip model is designed to meet specific design requirements and can be used in a variety of communication systems. It is also designed to be flexible and easily upgradable, allowing for future upgrades and improvements. It can be used in intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It can also be used in the era of fully intelligent systems, such as the Internet of Things (IoT). The product description and specific design requirements of the chip model should be carefully studied to ensure the best possible performance. Actual case studies and precautions should also be taken into account when using the chip model.
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