XCS20XL-3VQG100C
XCS20XL-3VQG100C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCS20XL-3VQG100C


XCS20XL-3VQG100C
F20-XCS20XL-3VQG100C
Active
FIELD PROGRAMMABLE GATE ARRAY, TFQFP
TFQFP

XCS20XL-3VQG100C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCS20XL-3VQG100C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 7000
Number of CLBs 400
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 400 CLBS, 7000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description TFQFP,
Pin Count 100
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS20XL-3VQG100C Datasheet Download


XCS20XL-3VQG100C Overview



The XCS20XL-3VQG100C chip model is designed to provide advanced communication systems with a powerful and reliable solution. It is a low-power, high-performance, low-cost solution that can be used in a wide range of applications. The chip model is designed to meet specific design requirements and can be used in a variety of communication systems.


The XCS20XL-3VQG100C chip model is designed to provide advanced communication systems with a powerful and reliable solution. It is a low-power, high-performance, low-cost solution that can be used in a wide range of applications. The chip model is designed to meet specific design requirements and can be used in a variety of communication systems. It is designed to provide high-speed data transfer, low latency, and high reliability. It is also designed to be compatible with a range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth.


The original design intention of the XCS20XL-3VQG100C chip model was to provide a powerful and reliable solution for advanced communication systems. It is designed to be used in a variety of applications, ranging from high-speed data transfer, low latency, and high reliability to compatibility with a range of communication protocols. It is also designed to be flexible and easily upgradable, allowing for future upgrades and improvements.


The XCS20XL-3VQG100C chip model is also designed to be used in advanced communication systems and networks. It can be used in intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It can also be used in the era of fully intelligent systems, such as the Internet of Things (IoT). The chip model is also designed to be secure, allowing for end-to-end encryption and authentication.


The product description and specific design requirements of the XCS20XL-3VQG100C chip model should be carefully studied to ensure the best possible performance. Actual case studies and precautions should also be taken into account when using the chip model. For example, the chip model should be used in a temperature-controlled environment, and the chip should be tested regularly to ensure that it is functioning properly.


In conclusion, the XCS20XL-3VQG100C chip model is designed to provide advanced communication systems with a powerful and reliable solution. It is a low-power, high-performance, low-cost solution that can be used in a wide range of applications. The chip model is designed to meet specific design requirements and can be used in a variety of communication systems. It is also designed to be flexible and easily upgradable, allowing for future upgrades and improvements. It can be used in intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It can also be used in the era of fully intelligent systems, such as the Internet of Things (IoT). The product description and specific design requirements of the chip model should be carefully studied to ensure the best possible performance. Actual case studies and precautions should also be taken into account when using the chip model.



1,220 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote