XCS20XL-3VQ100I
XCS20XL-3VQ100I
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rohs

AMD Xilinx

XCS20XL-3VQ100I


XCS20XL-3VQ100I
F20-XCS20XL-3VQ100I
Active
FIELD PROGRAMMABLE GATE ARRAY, TFQFP
TFQFP

XCS20XL-3VQ100I ECAD Model


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XCS20XL-3VQ100I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 7000
Number of CLBs 400
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 400 CLBS, 7000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description TFQFP,
Pin Count 100
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS20XL-3VQ100I Datasheet Download


XCS20XL-3VQ100I Overview



The XCS20XL-3VQ100I chip model is a cutting-edge technology designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used for describing digital systems in terms of their behavior. This chip model has the potential to be used in networks and intelligent scenarios, making it a great fit for the era of fully intelligent systems.


In terms of product description, the XCS20XL-3VQ100I chip model is a low-power, low-cost, high-performance FPGA that offers a variety of features and capabilities. It has a wide range of I/O and memory resources, allowing for the implementation of complex algorithms and applications. It also offers a low-latency and high-bandwidth interconnect fabric, making it ideal for applications that require high-speed data transfer. Additionally, it has two independent clock domains, allowing for the use of different clock frequencies for various tasks.


When it comes to design requirements, the XCS20XL-3VQ100I chip model has a few specific requirements that need to be met. First, it requires the use of HDL language, which is used to describe the behavior of the system. Second, it requires the use of an appropriate development environment, such as Xilinx Vivado or Altera Quartus. Third, it requires the use of a suitable hardware platform, such as a development board or a custom circuit board. Finally, it requires the use of a suitable software toolchain, such as the Xilinx Vivado or Altera Quartus tools.


To ensure the successful implementation of the XCS20XL-3VQ100I chip model, there are a few case studies and precautions that should be taken into consideration. First, it is important to ensure that the HDL language is correct and that all design rules are followed. Second, it is important to ensure that the development environment is suitable for the application and that all necessary tools are available. Third, it is important to ensure that the hardware platform is suitable for the application and that all necessary components are available. Finally, it is important to ensure that the software toolchain is suitable for the application and that all necessary tools are available.


Overall, the XCS20XL-3VQ100I chip model is a cutting-edge technology designed for high-performance digital signal processing, embedded processing, and image processing. It has the potential to be used in networks and intelligent scenarios, making it a great fit for the era of fully intelligent systems. It requires the use of HDL language, an appropriate development environment, a suitable hardware platform, and a suitable software toolchain. Additionally, there are a few case studies and precautions that should be taken into consideration when implementing the chip model.



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