
AMD Xilinx
XCS20XL-3TQG144C
XCS20XL-3TQG144C ECAD Model
XCS20XL-3TQG144C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 7000 | |
Number of CLBs | 400 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 400 CLBS, 7000 GATES | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS20XL-3TQG144C Datasheet Download
XCS20XL-3TQG144C Overview
The XCS20XL-3TQG144C chip model is a high-performance, low-power, and low-cost FPGA (Field Programmable Gate Array) designed for digital signal processing, embedded processing, image processing, and other applications. It is equipped with a wide range of features, such as an embedded processor, an optimized architecture, and a high-speed transceiver. The chip model is ideal for applications that require high performance, low latency, and low power consumption.
The XCS20XL-3TQG144C chip model is designed to provide users with the flexibility to customize their designs. It is equipped with a wide range of features, including a configurable logic block, a distributed memory, and a dedicated I/O block. The chip model is also equipped with an embedded processor, which is suitable for applications that require a high degree of flexibility. The chip model also supports multiple clock domains, which allows users to design their own clock domains.
The XCS20XL-3TQG144C chip model is designed to be easy to use. It is compatible with a variety of HDL (Hardware Description Language) languages, such as Verilog, VHDL, and System Verilog. This allows users to easily design and develop their own applications. The chip model also supports a wide range of development tools, such as the Xilinx Vivado Design Suite and the Altera Quartus II Design Suite.
The demand for the XCS20XL-3TQG144C chip model is expected to increase in the future as more and more applications require high-performance digital signal processing, embedded processing, and image processing. The chip model is also expected to become more popular in the automotive, aerospace, and medical industries.
When designing with the XCS20XL-3TQG144C chip model, it is important to consider the specific design requirements. The chip model should be configured to meet the specific application requirements, such as the number of logic blocks, the size of the memory, and the type of I/O block. It is also important to consider the power requirements of the application. The chip model should also be configured to meet the specific timing requirements of the application.
In order to ensure the successful implementation of the XCS20XL-3TQG144C chip model, it is important to consider actual case studies and precautions. It is important to consider the actual implementation of the chip model in order to ensure that the design meets the specific application requirements. It is also important to consider any potential issues that could arise during the implementation of the chip model.
In conclusion, the XCS20XL-3TQG144C chip model is a high-performance, low-power, and low-cost FPGA designed for digital signal processing, embedded processing, image processing, and other applications. The chip model is equipped with a wide range of features, including a configurable logic block, a distributed memory, and a dedicated I/O block. The chip model is also compatible with a variety of HDL languages and supports a wide range of development tools. The demand for the chip model is expected to increase in the future as more and more applications require high-performance digital signal processing, embedded processing, and image processing. When designing with the XCS20XL-3TQG144C chip model, it is important to consider the specific design requirements, as well as actual case studies and precautions.
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