XCS20XL-3PQG208I
XCS20XL-3PQG208I
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rohs

AMD Xilinx

XCS20XL-3PQG208I


XCS20XL-3PQG208I
F20-XCS20XL-3PQG208I
Active
FIELD PROGRAMMABLE GATE ARRAY, FQFP
FQFP

XCS20XL-3PQG208I ECAD Model


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XCS20XL-3PQG208I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 7000
Number of CLBs 400
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 400 CLBS, 7000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 208
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS20XL-3PQG208I Datasheet Download


XCS20XL-3PQG208I Overview



The chip model XCS20XL-3PQG208I is a highly advanced and powerful integrated circuit (IC) designed to meet the needs of modern communication systems. As the industry continues to evolve, this chip model has become increasingly popular among system designers due to its reliable performance and wide range of features.


The XCS20XL-3PQG208I is a low-power, high-speed, low-noise IC that supports a variety of communication protocols and standards. It is designed to handle multiple data streams simultaneously and can be used in both wired and wireless systems. This chip model is also capable of supporting multiple frequency bands, making it ideal for use in a wide variety of applications.


In terms of industry trends, the XCS20XL-3PQG208I is designed to be compatible with the latest technologies, including 5G, Wi-Fi 6, and Bluetooth 5.0. This allows the chip model to be used in a variety of advanced communication systems without the need for additional hardware or software. Additionally, the chip model is designed to be future-proof, meaning that it can be upgraded to support new technologies as they become available.


In terms of product design, the XCS20XL-3PQG208I has a wide range of features that make it suitable for a variety of applications. It is designed to be highly efficient and reliable, with a low power consumption and a low noise level. Additionally, the chip model is designed to be highly customizable, allowing system designers to tailor the chip model to their specific needs.


To ensure the successful implementation of the XCS20XL-3PQG208I, there are a few key considerations that need to be taken into account. First, the chip model should be tested in the target application environment to ensure that it meets the necessary performance requirements. Additionally, system designers should be aware of any potential compatibility issues that may arise when integrating the chip model into their application. Finally, it is important to ensure that the chip model is properly protected against any form of tampering or unauthorized access.


In conclusion, the XCS20XL-3PQG208I is a powerful, reliable, and highly customizable integrated circuit designed to meet the needs of modern communication systems. As the industry continues to evolve, this chip model has become increasingly popular due to its wide range of features and its ability to support the latest technologies. With the proper precautions and considerations, this chip model can be successfully implemented into any system.



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