AMD Xilinx
XCS20XL-3PQG208I
XCS20XL-3PQG208I ECAD Model
XCS20XL-3PQG208I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 400 CLBS, 7000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS20XL-3PQG208I Datasheet Download
XCS20XL-3PQG208I Overview
The chip model XCS20XL-3PQG208I is a highly advanced and powerful integrated circuit (IC) designed to meet the needs of modern communication systems. As the industry continues to evolve, this chip model has become increasingly popular among system designers due to its reliable performance and wide range of features.
The XCS20XL-3PQG208I is a low-power, high-speed, low-noise IC that supports a variety of communication protocols and standards. It is designed to handle multiple data streams simultaneously and can be used in both wired and wireless systems. This chip model is also capable of supporting multiple frequency bands, making it ideal for use in a wide variety of applications.
In terms of industry trends, the XCS20XL-3PQG208I is designed to be compatible with the latest technologies, including 5G, Wi-Fi 6, and Bluetooth 5.0. This allows the chip model to be used in a variety of advanced communication systems without the need for additional hardware or software. Additionally, the chip model is designed to be future-proof, meaning that it can be upgraded to support new technologies as they become available.
In terms of product design, the XCS20XL-3PQG208I has a wide range of features that make it suitable for a variety of applications. It is designed to be highly efficient and reliable, with a low power consumption and a low noise level. Additionally, the chip model is designed to be highly customizable, allowing system designers to tailor the chip model to their specific needs.
To ensure the successful implementation of the XCS20XL-3PQG208I, there are a few key considerations that need to be taken into account. First, the chip model should be tested in the target application environment to ensure that it meets the necessary performance requirements. Additionally, system designers should be aware of any potential compatibility issues that may arise when integrating the chip model into their application. Finally, it is important to ensure that the chip model is properly protected against any form of tampering or unauthorized access.
In conclusion, the XCS20XL-3PQG208I is a powerful, reliable, and highly customizable integrated circuit designed to meet the needs of modern communication systems. As the industry continues to evolve, this chip model has become increasingly popular due to its wide range of features and its ability to support the latest technologies. With the proper precautions and considerations, this chip model can be successfully implemented into any system.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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