AMD Xilinx
XCS20-3VQG100I
XCS20-3VQG100I ECAD Model
XCS20-3VQG100I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 400 CLBS, 7000 GATES | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS20-3VQG100I Datasheet Download
XCS20-3VQG100I Overview
The XCS20-3VQG100I chip model is a powerful and versatile device that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using HDL language, making it an ideal choice for a variety of digital applications.
The XCS20-3VQG100I chip model offers a number of advantages over other similar models. It is highly reliable, with a low power consumption and a wide operating temperature range. The chip also has a high degree of flexibility, allowing it to be used in a wide range of applications. Additionally, the chip is highly scalable, making it easy to upgrade and expand its capabilities.
The XCS20-3VQG100I chip model is expected to have a bright future in the industry, as more and more applications require the use of this type of device. As technology advances, the XCS20-3VQG100I chip model is likely to become even more popular. The chip model is also likely to be adopted in more applications, as it is highly reliable and offers a wide range of features and capabilities.
The XCS20-3VQG100I chip model is also likely to be in high demand in the future, as it is a cost-effective solution for a wide range of applications. The chip is also likely to be used in more and more applications, as it is highly reliable and offers a wide range of features and capabilities. Additionally, the chip is likely to be used in more and more applications, as it is highly scalable and can be easily upgraded and expanded.
In terms of the application environment, the XCS20-3VQG100I chip model may require the support of new technologies in order to meet the needs of the various applications that it is used in. As technology advances, the chip model may require the use of new technologies in order to keep up with the changing demands in the industry.
Overall, the XCS20-3VQG100I chip model is an ideal choice for a wide range of applications. It is highly reliable, with a low power consumption and a wide operating temperature range. Additionally, the chip is highly scalable, making it easy to upgrade and expand its capabilities. As technology advances, the chip is likely to become even more popular, as it is cost-effective and offers a wide range of features and capabilities. The chip is also likely to be used in more and more applications, as it is highly reliable and offers a wide range of features and capabilities. Additionally, the chip may require the use of new technologies in order to keep up with the changing demands in the industry.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||