XCS20-3VQ100I
XCS20-3VQ100I
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rohs

AMD Xilinx

XCS20-3VQ100I


XCS20-3VQ100I
F20-XCS20-3VQ100I
Active
FIELD PROGRAMMABLE GATE ARRAY, PLASTIC, VQFP-100
PLASTIC, VQFP-100

XCS20-3VQ100I ECAD Model


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XCS20-3VQ100I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 7000
Number of CLBs 400
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 400 CLBS, 7000 GATES
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description PLASTIC, VQFP-100
Pin Count 100
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS20-3VQ100I Datasheet Download


XCS20-3VQ100I Overview



The chip model XCS20-3VQ100I is a powerful semiconductor device that is widely used in high-performance digital signal processing, embedded processing, and image processing. It is the latest model developed by the renowned semiconductor manufacturer Xilinx and is designed to meet the demands of the modern digital age. This chip model is capable of running at a high clock speed and can be programmed using the HDL language.


The chip model XCS20-3VQ100I has many advantages. It is highly reliable, as it is designed to withstand extreme temperatures and other environmental conditions. Furthermore, it is energy-efficient and consumes less power than other similar models. Its chip architecture is also designed in such a way that it can be easily integrated into various systems and applications.


The chip model XCS20-3VQ100I is expected to be in high demand in the near future, especially in the fields of embedded processing and image processing. With the increasing popularity of artificial intelligence and robotics, the chip model is likely to be used in the development and popularization of future intelligent robots.


In order to effectively use the chip model XCS20-3VQ100I, certain technical skills are required. These include a good understanding of HDL language, as well as knowledge of embedded processing and image processing. Additionally, the user must have a good understanding of the chip architecture and the system integration process.


Overall, the chip model XCS20-3VQ100I is an excellent choice for high-performance digital signal processing, embedded processing, and image processing applications. Its reliability, energy-efficiency, and chip architecture make it a great choice for the development of future intelligent robots. With the right technical skills, it can be used effectively for a wide range of applications.



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