AMD Xilinx
XCS20-3TQG144C
XCS20-3TQG144C ECAD Model
XCS20-3TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 400 CLBS, 7000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 20000 | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS20-3TQG144C Datasheet Download
XCS20-3TQG144C Overview
The XCS20-3TQG144C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed with a high-level hardware description language (HDL) and can be used in various applications. This chip model is suitable for developing and popularizing future intelligent robots, as its advanced features enable it to perform complex tasks efficiently.
The XCS20-3TQG144C chip model is a high-performance, low-power solution with a wide range of features. It is capable of performing multiple operations in parallel, making it suitable for a variety of applications. It also offers a low-cost solution for digital signal processing and embedded processing, making it an ideal choice for those looking for a cost-effective solution.
The XCS20-3TQG144C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is equipped with advanced features such as a high-level hardware description language (HDL) and a wide range of I/O options, making it suitable for a variety of applications. It can also be used to develop and popularize future intelligent robots, as it is capable of performing complex tasks efficiently.
To effectively utilize the XCS20-3TQG144C chip model, a team of technical experts is needed. These experts should have a thorough understanding of HDL and be familiar with the design and development of embedded systems. Furthermore, they should have the necessary skills to debug and troubleshoot the system.
In order to ensure the successful application of the XCS20-3TQG144C chip model, it is important to read the product description and specific design requirements carefully. Additionally, case studies should be studied and precautions should be taken to avoid any potential pitfalls.
Overall, the XCS20-3TQG144C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is suitable for developing and popularizing future intelligent robots and can be used effectively with the help of a team of technical experts. Careful consideration of the product description and specific design requirements, as well as actual case studies, should be taken into account to ensure successful application of the chip model.
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