AMD Xilinx
XCS20-3PQG208C
XCS20-3PQG208C ECAD Model
XCS20-3PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 400 CLBS, 7000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 20000 | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS20-3PQG208C Datasheet Download
XCS20-3PQG208C Overview
The chip model XCS20-3PQG208C is a cutting-edge technology developed by Xilinx, Inc. It is a high-performance, low-cost, low-power Field Programmable Gate Array (FPGA) chip. This chip model is an ideal choice for a wide range of applications, such as embedded systems, communications, storage, and industrial automation. It has the advantages of high performance, low power consumption, and high integration density.
The chip model XCS20-3PQG208C is expected to have a great demand in related industries in the future. The chip model has the potential to be used in a variety of applications, such as data centers, automotive, and healthcare. It can provide a high level of performance and scalability, which makes it an attractive choice for many applications. It can also provide a cost-effective solution for many applications.
The chip model XCS20-3PQG208C can be used in networks and intelligent scenarios. It can be used to enable intelligent systems, such as self-driving cars and smart homes. It can be used to provide real-time data processing, which is essential for intelligent systems. It can also be used to enable the secure transmission of data, which is crucial for the development of intelligent systems.
The chip model XCS20-3PQG208C is a promising technology for the future. It has the potential to be used in a variety of applications, from embedded systems to intelligent systems. It can provide a high level of performance and scalability, as well as a cost-effective solution. It can also enable the secure transmission of data, which is crucial for the development of intelligent systems. As the demand for intelligent systems continues to grow, the chip model XCS20-3PQG208C is expected to become an important part of the future.
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3,630 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $65.7101 | $65.7101 |
| 10+ | $65.0035 | $650.0352 |
| 100+ | $61.4707 | $6,147.0720 |
| 1000+ | $57.9379 | $28,968.9600 |
| 10000+ | $52.9920 | $52,992.0000 |
| The price is for reference only, please refer to the actual quotation! | ||