
AMD Xilinx
XCS10XL-5VQG100C
XCS10XL-5VQG100C ECAD Model
XCS10XL-5VQG100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 77 | |
Number of Outputs | 77 | |
Number of Logic Cells | 466 | |
Number of Equivalent Gates | 3000 | |
Number of CLBs | 196 | |
Combinatorial Delay of a CLB-Max | 1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 196 CLBS, 3000 GATES | |
Additional Feature | MAXIMUM USABLE GATES 10000 | |
Clock Frequency-Max | 250 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP100,.63SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | TFQFP, TQFP100,.63SQ | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCS10XL-5VQG100C Datasheet Download
XCS10XL-5VQG100C Overview
The XCS10XL-5VQG100C chip model is an advanced semiconductor product designed and manufactured by Xilinx, Inc. It is a low-power, high-performance, and cost-effective solution for a variety of applications, ranging from consumer electronics to industrial automation. This chip model is suitable for applications in the field of network communication and intelligent systems.
The XCS10XL-5VQG100C chip model is designed to provide high performance and low power consumption, which makes it a cost-effective solution for many applications. It is capable of operating at a wide range of frequencies and supports a variety of communication protocols. The chip model also offers a wide range of features, including multi-protocol support, high-speed signal processing, and low-power consumption. Additionally, it is also designed with a variety of security features to ensure the safety and reliability of the system.
The XCS10XL-5VQG100C chip model is expected to be in high demand in the near future due to its low power consumption and high performance. Moreover, its support for a variety of communication protocols makes it suitable for a variety of applications, ranging from consumer electronics to industrial automation. Additionally, the chip model is expected to be used in the era of fully intelligent systems, as it is capable of providing high-speed signal processing and a wide range of security features.
The product description and specific design requirements of the XCS10XL-5VQG100C chip model are available in the product datasheet. It is designed with a wide range of features, including multi-protocol support, high-speed signal processing, and low-power consumption. Additionally, it is also designed with a variety of security features to ensure the safety and reliability of the system.
The XCS10XL-5VQG100C chip model has been successfully used in a variety of applications, ranging from consumer electronics to industrial automation. Case studies have shown that this chip model is capable of providing high performance and low power consumption, making it a cost-effective solution for many applications. Additionally, the chip model is also suitable for use in the era of fully intelligent systems, as it is capable of providing high-speed signal processing and a wide range of security features.
When using the XCS10XL-5VQG100C chip model, it is important to ensure that the design requirements are met. Additionally, it is also important to ensure that the chip model is used in an environment with adequate cooling and that the chip model is not exposed to any extreme temperatures. Additionally, it is important to ensure that the chip model is not exposed to any electrostatic discharge, as this can damage the chip model.
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1,772 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $12.5550 | $12.5550 |
10+ | $12.4200 | $124.2000 |
100+ | $11.7450 | $1,174.5000 |
1000+ | $11.0700 | $5,535.0000 |
10000+ | $10.1250 | $10,125.0000 |
The price is for reference only, please refer to the actual quotation! |