XCS10XL-5VQG100C
XCS10XL-5VQG100C
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rohs

AMD Xilinx

XCS10XL-5VQG100C


XCS10XL-5VQG100C
F20-XCS10XL-5VQG100C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, TFQFP, TQFP100,.63SQ
TFQFP, TQFP100,.63SQ

XCS10XL-5VQG100C ECAD Model


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XCS10XL-5VQG100C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 77
Number of Outputs 77
Number of Logic Cells 466
Number of Equivalent Gates 3000
Number of CLBs 196
Combinatorial Delay of a CLB-Max 1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 196 CLBS, 3000 GATES
Additional Feature MAXIMUM USABLE GATES 10000
Clock Frequency-Max 250 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Equivalence Code TQFP100,.63SQ
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description TFQFP, TQFP100,.63SQ
Pin Count 100
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCS10XL-5VQG100C Datasheet Download


XCS10XL-5VQG100C Overview



The XCS10XL-5VQG100C chip model is an advanced semiconductor product designed and manufactured by Xilinx, Inc. It is a low-power, high-performance, and cost-effective solution for a variety of applications, ranging from consumer electronics to industrial automation. This chip model is suitable for applications in the field of network communication and intelligent systems.


The XCS10XL-5VQG100C chip model is designed to provide high performance and low power consumption, which makes it a cost-effective solution for many applications. It is capable of operating at a wide range of frequencies and supports a variety of communication protocols. The chip model also offers a wide range of features, including multi-protocol support, high-speed signal processing, and low-power consumption. Additionally, it is also designed with a variety of security features to ensure the safety and reliability of the system.


The XCS10XL-5VQG100C chip model is expected to be in high demand in the near future due to its low power consumption and high performance. Moreover, its support for a variety of communication protocols makes it suitable for a variety of applications, ranging from consumer electronics to industrial automation. Additionally, the chip model is expected to be used in the era of fully intelligent systems, as it is capable of providing high-speed signal processing and a wide range of security features.


The product description and specific design requirements of the XCS10XL-5VQG100C chip model are available in the product datasheet. It is designed with a wide range of features, including multi-protocol support, high-speed signal processing, and low-power consumption. Additionally, it is also designed with a variety of security features to ensure the safety and reliability of the system.


The XCS10XL-5VQG100C chip model has been successfully used in a variety of applications, ranging from consumer electronics to industrial automation. Case studies have shown that this chip model is capable of providing high performance and low power consumption, making it a cost-effective solution for many applications. Additionally, the chip model is also suitable for use in the era of fully intelligent systems, as it is capable of providing high-speed signal processing and a wide range of security features.


When using the XCS10XL-5VQG100C chip model, it is important to ensure that the design requirements are met. Additionally, it is also important to ensure that the chip model is used in an environment with adequate cooling and that the chip model is not exposed to any extreme temperatures. Additionally, it is important to ensure that the chip model is not exposed to any electrostatic discharge, as this can damage the chip model.



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Unit Price: $13.50
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Pricing (USD)

QTY Unit Price Ext Price
1+ $12.5550 $12.5550
10+ $12.4200 $124.2000
100+ $11.7450 $1,174.5000
1000+ $11.0700 $5,535.0000
10000+ $10.1250 $10,125.0000
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