AMD Xilinx
XCS10XL-5TQG144C
XCS10XL-5TQG144C ECAD Model
XCS10XL-5TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 112 | |
| Number of Outputs | 112 | |
| Number of Logic Cells | 466 | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 196 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 196 CLBS, 3000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 10000 | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCS10XL-5TQG144C Datasheet Download
XCS10XL-5TQG144C Overview
The XCS10XL-5TQG144C chip model is an advanced, low-cost, low-power integrated circuit (IC) designed for use in communication systems. This chip model is designed to provide a high level of performance, flexibility, and scalability for next-generation systems. It is also designed to be highly reliable and to meet the needs of modern communication systems.
The XCS10XL-5TQG144C chip model is a powerful and versatile IC that can be used in a wide range of applications. It is suitable for use in both wired and wireless networks, as well as in advanced communication systems. This chip model can be used to build high-speed, low-latency networks and to enable intelligent services. It is also capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0.
The XCS10XL-5TQG144C chip model is designed to provide a high level of performance and flexibility. It is capable of supporting a wide range of applications and can be used to build highly reliable networks. It is also designed to be highly scalable, allowing it to be used in both small and large-scale networks. This chip model can also be used to build intelligent systems, such as autonomous vehicles, smart homes, and IoT networks.
The XCS10XL-5TQG144C chip model is designed to meet the specific needs of modern communication systems. It is designed to be highly reliable and to provide a high level of performance and flexibility. This chip model is also designed to be highly scalable and to be able to support a wide range of applications. It is also designed to be highly power efficient and to be capable of supporting the latest technologies.
The XCS10XL-5TQG144C chip model is designed to be highly reliable and to meet the specific needs of modern communication systems. It is capable of supporting a wide range of applications and can be used to build highly reliable networks. It is also designed to be highly scalable and to be able to support the latest technologies. In addition, it is designed to be highly power efficient and to provide a high level of performance and flexibility.
In addition to the XCS10XL-5TQG144C chip model, there are also a number of other chip models that can be used in communication systems. These include the XCS12XL-2TQG144C and the XCS14XL-4TQG144C. These chip models are designed to provide a high level of performance and flexibility and can be used to build highly reliable networks.
The XCS10XL-5TQG144C chip model is designed to be highly reliable and to meet the specific needs of modern communication systems. It is capable of supporting a wide range of applications and can be used to build highly reliable networks. It is also designed to be highly scalable and to be able to support the latest technologies. In addition, it is designed to be highly power efficient and to provide a high level of performance and flexibility.
The XCS10XL-5TQG144C chip model is capable of being upgraded in the future and can be used in advanced communication systems. It is also possible for this chip model to be used in the era of fully intelligent systems. In addition, it can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and IoT networks.
When using the XCS10XL-5TQG144C chip model, it is important to ensure that the product description and design requirements are followed. This will ensure that the chip model is used in the most efficient and effective way possible. It is also important to be aware of any potential risks associated with using this chip model, such as potential security vulnerabilities. It is also important to be aware of any case studies that have been conducted on the use of this chip model, as this can provide valuable insight into how it can be used in different scenarios.
You May Also Be Interested In
2,390 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13.6762 | $13.6762 |
| 10+ | $13.5292 | $135.2915 |
| 100+ | $12.7939 | $1,279.3872 |
| 1000+ | $12.0586 | $6,029.2960 |
| 10000+ | $11.0292 | $11,029.2000 |
| The price is for reference only, please refer to the actual quotation! | ||