AMD Xilinx
XCS10XL-3VQ100I
XCS10XL-3VQ100I ECAD Model
XCS10XL-3VQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 196 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 196 CLBS, 3000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Package Description | TFQFP, | |
| Pin Count | 100 |
XCS10XL-3VQ100I Datasheet Download
XCS10XL-3VQ100I Overview
The XCS10XL-3VQ100I chip model is an advanced integrated circuit developed by Xilinx Corporation. It is a low-power, low-cost FPGA (Field Programmable Gate Array) device that is designed to provide high performance, flexibility and scalability. This chip model is ideal for a variety of applications including high-speed communication systems, digital signal processing, and embedded systems.
The original design intention of the XCS10XL-3VQ100I chip model was to provide a low-cost, low-power solution for a wide range of applications. It was designed to be flexible and scalable, allowing for future upgrades and modifications. The chip model can be used for a variety of applications, including high-speed communication systems, digital signal processing, and embedded systems. It is also capable of being used in advanced communication systems, such as 5G networks, and can be used in the era of fully intelligent systems.
The product description of the XCS10XL-3VQ100I chip model includes features such as an embedded ARM processor, a large memory array, and a high-speed serial interface. It also has a wide range of I/O options, including LVDS, GPIO, and USB. The chip model is designed to be low-cost, low-power, and highly reliable. It also has a wide range of features and capabilities, making it suitable for a variety of applications.
Case studies have been conducted to assess the performance of the XCS10XL-3VQ100I chip model. These studies have shown that the chip model is capable of providing high-speed communication, digital signal processing, and embedded systems applications. It is also capable of being used in advanced communication systems, such as 5G networks, and can be used in the era of fully intelligent systems.
When using the XCS10XL-3VQ100I chip model, it is important to consider the specific design requirements of the application. It is also important to ensure that the chip model is properly configured and that all necessary precautions are taken to ensure its reliability. This includes ensuring that the chip model is properly cooled and that the power supply is adequate. Additionally, it is important to ensure that the chip model is properly programmed and that all necessary safety protocols are followed.
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|---|---|---|
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