AMD Xilinx
XCS10XL-3VQ100C
XCS10XL-3VQ100C ECAD Model
XCS10XL-3VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 112 | |
| Number of Outputs | 112 | |
| Number of Logic Cells | 196 | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 196 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 196 CLBS, 3000 GATES | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCS10XL-3VQ100C Datasheet Download
XCS10XL-3VQ100C Overview
The XCS10XL-3VQ100C chip model is a powerful tool for addressing a variety of digital signal processing, embedded processing, and image processing needs. It is a highly versatile and efficient model that is suitable for use in a wide range of applications. It is capable of providing high-performance processing with a minimal amount of power consumption. The chip model also comes with a comprehensive set of HDL language tools that make it easy to program and use.
The XCS10XL-3VQ100C chip model has a number of advantages that make it an attractive choice for many industries. It is highly efficient, allowing for greater performance with less power consumption. It is also extremely versatile, providing a wide range of features and capabilities. Additionally, the chip model is highly reliable, making it a reliable choice for long-term applications.
The demand for the XCS10XL-3VQ100C chip model is expected to continue to grow in the future. This is due to the increasing need for high-performance digital signal processing, embedded processing, and image processing in many industries. As such, the chip model is likely to remain a popular choice for many applications.
The XCS10XL-3VQ100C chip model is also likely to be used in a variety of network and intelligent scenarios in the future. It is capable of providing high-performance processing in a wide range of applications, making it a valuable tool for many industries. Additionally, the chip model is likely to be used in the era of fully intelligent systems, as it is capable of providing the necessary performance and reliability for such applications.
Overall, the XCS10XL-3VQ100C chip model is an incredibly powerful and versatile tool for a wide range of digital signal processing, embedded processing, and image processing needs. It is highly efficient, reliable, and versatile, making it an attractive choice for many industries. Additionally, the chip model is likely to remain a popular choice for many applications in the future, as well as being used in a variety of network and intelligent scenarios.
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3,901 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13.7640 | $13.7640 |
| 10+ | $13.6160 | $136.1600 |
| 100+ | $12.8760 | $1,287.6000 |
| 1000+ | $12.1360 | $6,068.0000 |
| 10000+ | $11.1000 | $11,100.0000 |
| The price is for reference only, please refer to the actual quotation! | ||