XCS10XL-3TQG144I
XCS10XL-3TQG144I
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rohs

AMD Xilinx

XCS10XL-3TQG144I


XCS10XL-3TQG144I
F20-XCS10XL-3TQG144I
Active
FIELD PROGRAMMABLE GATE ARRAY, LFQFP
LFQFP

XCS10XL-3TQG144I ECAD Model


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XCS10XL-3TQG144I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 3000
Number of CLBs 196
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 196 CLBS, 3000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Number of Terminals 144
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 20 mm
Length 20 mm
Seated Height-Max 1.6 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description LFQFP,
Pin Count 144
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS10XL-3TQG144I Datasheet Download


XCS10XL-3TQG144I Overview



The chip model XCS10XL-3TQG144I is a powerful and advanced integrated circuit that has been designed to meet the needs of the modern digital world. It is an innovative solution that combines the best of both worlds; the power of modern computing and the flexibility of modern communication. This chip model is a perfect example of how technology is constantly evolving, and how it can be used to create powerful solutions for today's digital world.


The XCS10XL-3TQG144I chip model is designed to provide advanced features such as high-speed data processing, high-speed data transmission, low power consumption, and scalability. This chip model also includes advanced security features, making it a great choice for applications that require reliable and secure data processing. Additionally, the chip model is designed to be compatible with a wide range of communication protocols, making it an excellent choice for applications that require communication between multiple devices.


The XCS10XL-3TQG144I chip model is expected to experience a surge in demand in the future, as more and more industries are looking for advanced solutions that can provide reliable and secure data processing. Additionally, the chip model is designed to be easily upgradable, making it an excellent choice for applications that require the latest technology. Furthermore, the chip model is designed to be compatible with a wide range of communication protocols, making it an ideal choice for applications that require communication between multiple devices.


The XCS10XL-3TQG144I chip model is a powerful and versatile solution that can be applied to a wide range of applications. It is a perfect choice for applications that require communication between multiple devices, as well as applications that require reliable and secure data processing. Additionally, the chip model is designed to be compatible with a wide range of communication protocols, making it an ideal choice for applications that require communication between multiple devices.


The XCS10XL-3TQG144I chip model is expected to find application in the era of fully intelligent systems, as it is designed to be compatible with a wide range of communication protocols, making it an ideal choice for applications that require communication between multiple devices. Additionally, the chip model is designed to be easily upgradable, making it a great choice for applications that require the latest technology. Furthermore, the chip model is designed to be compatible with a wide range of communication protocols, making it an ideal choice for applications that require communication between multiple devices.


In conclusion, the XCS10XL-3TQG144I chip model is a powerful and advanced integrated circuit that is designed to meet the needs of the modern digital world. It is an innovative solution that combines the best of both worlds; the power of modern computing and the flexibility of modern communication. This chip model is expected to experience a surge in demand in the future, as more and more industries are looking for advanced solutions that can provide reliable and secure data processing. Additionally, the chip model is designed to be easily upgradable, making it an excellent choice for applications that require the latest technology. Furthermore, the chip model is designed to be compatible with a wide range of communication protocols, making it an ideal choice for applications that require communication between multiple devices. It is also expected to find application in the era of fully intelligent systems, as it is designed to be compatible with a wide range of communication protocols, making it an ideal choice for applications that require communication between multiple devices.



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