AMD Xilinx
XCS10XL-3TQG144C
XCS10XL-3TQG144C ECAD Model
XCS10XL-3TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 196 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 196 CLBS, 3000 GATES | |
| Additional Feature | CAN ALSO USE 10000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS10XL-3TQG144C Datasheet Download
XCS10XL-3TQG144C Overview
The XCS10XL-3TQG144C chip model was designed with the intention of providing a flexible and powerful platform for the development of advanced communication systems. It is a low-power, low-cost device that can support a wide range of applications, from basic data processing to complex communication tasks. It is also capable of being upgraded in the future, making it suitable for use in the era of fully intelligent systems.
The XCS10XL-3TQG144C chip model is a versatile device that can be used in a variety of applications, including networks, intelligent scenarios, and robotics. In terms of networks, it can be used to facilitate communication between devices, making it an ideal choice for the development of advanced communication systems. In terms of intelligent scenarios, it can be used to power intelligent systems, enabling them to respond to external stimuli and process data in real-time. Finally, in terms of robotics, it can be used to power robots and enable them to carry out complex tasks with greater accuracy and efficiency.
In order to effectively use the XCS10XL-3TQG144C chip model, certain technical skills are required. This includes knowledge of programming languages such as C and C++, as well as familiarity with the architecture of the chip model. Additionally, knowledge of the various communication protocols and algorithms used in the chip model is also essential. Finally, understanding of the various hardware components of the chip model is also necessary to ensure that it is used to its fullest potential.
Overall, the XCS10XL-3TQG144C chip model is a powerful and versatile device that can be used in a variety of applications, from networks and intelligent scenarios to robotics. It is a low-cost and low-power device that can be upgraded in the future, making it suitable for use in the era of fully intelligent systems. In order to use the chip model effectively, certain technical skills are required, including knowledge of programming languages, communication protocols, and hardware components.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||