AMD Xilinx
XCS10-4TQG144C
XCS10-4TQG144C ECAD Model
XCS10-4TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 196 | |
| Combinatorial Delay of a CLB-Max | 1.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 196 CLBS, 3000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 10000 | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS10-4TQG144C Datasheet Download
XCS10-4TQG144C Overview
The Xilinx XCS10-4TQG144C is an advanced chip model that has revolutionized the industry. It is a single-chip, multi-core, low-power solution that offers unprecedented levels of performance and scalability. This makes it an ideal choice for a wide range of applications, from embedded systems to high-performance computing.
The XCS10-4TQG144C chip model is designed to meet the demands of the rapidly changing technology landscape. It is equipped with advanced features such as dual-core ARM Cortex-A9 processors, integrated FPGA, and high-speed memory interfaces. This makes it suitable for a wide range of applications, from embedded systems to high-performance computing.
The XCS10-4TQG144C chip model offers a number of advantages over other chip models, such as improved power efficiency, better scalability, and higher performance. It is also capable of running multiple cores simultaneously, allowing for better parallel processing. This makes it suitable for a wide range of applications, from embedded systems to high-performance computing.
The XCS10-4TQG144C chip model is expected to be in high demand in the future, as it is designed to meet the needs of the rapidly changing technology landscape. It is expected to be used in a variety of networks and intelligent scenarios, such as autonomous vehicles, robotics, and the Internet of Things. It is also expected to be used in the era of fully intelligent systems, as it is capable of running multiple cores simultaneously and is highly scalable.
In conclusion, the Xilinx XCS10-4TQG144C chip model is a revolutionary chip model that is expected to be in high demand in the future. It is designed to meet the needs of the rapidly changing technology landscape and is capable of running multiple cores simultaneously. It is expected to be used in a variety of networks and intelligent scenarios, as well as being used in the era of fully intelligent systems.
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