AMD Xilinx
XCS05XL-4VQG100I
XCS05XL-4VQG100I ECAD Model
XCS05XL-4VQG100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 77 | |
| Number of Outputs | 77 | |
| Number of Logic Cells | 238 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 2000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 5000 | |
| Clock Frequency-Max | 217 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, TQFP100,.63SQ | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCS05XL-4VQG100I Datasheet Download
XCS05XL-4VQG100I Overview
The chip model XCS05XL-4VQG100I is an integrated circuit (IC) with a range of applications in the consumer electronics, automotive, and industrial sectors. It is a highly advanced IC that offers a wide range of features and benefits to users. The model is designed to provide high-performance, low-power, and cost-effective solutions to the market.
The chip model XCS05XL-4VQG100I is an ideal choice for applications that require high-speed data transmission, low power consumption, and cost savings. The model is designed to offer a high level of performance and reliability, making it suitable for a wide range of applications. The chip model is also designed to be compatible with a variety of existing technologies.
The chip model XCS05XL-4VQG100I has a range of features that make it suitable for a range of applications. The model is designed to provide high-speed data transmission, low power consumption, and cost savings. The chip model is also designed to be compatible with a variety of existing technologies. The model is also designed to be compatible with a variety of existing technologies, making it suitable for a variety of applications.
The chip model XCS05XL-4VQG100I is designed to provide high-performance, low-power, and cost-effective solutions to the market. The model is designed to be compatible with a variety of existing technologies, making it suitable for a variety of applications. The model is also designed to be compatible with a variety of existing technologies, making it suitable for a variety of applications.
The chip model XCS05XL-4VQG100I is expected to experience increased demand in the future due to its high-performance, low-power, and cost-effective design. The model is expected to be used in a wide range of applications, from consumer electronics to automotive and industrial applications. The model is also expected to be used in a variety of applications that require new technologies, such as artificial intelligence and machine learning.
In order to ensure that the chip model XCS05XL-4VQG100I meets the requirements of the application environment, it is important to consider the specific design requirements and product description of the chip model. It is also important to consider the actual case studies and precautions that are relevant to the application.
Overall, the chip model XCS05XL-4VQG100I is an ideal choice for applications that require high-speed data transmission, low power consumption, and cost savings. The model is expected to experience increased demand in the future due to its high-performance, low-power, and cost-effective design. In order to ensure that the chip model meets the requirements of the application environment, it is important to consider the specific design requirements and product description of the chip model, as well as the actual case studies and precautions that are relevant to the application.
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2,984 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20.8320 | $20.8320 |
| 10+ | $20.6080 | $206.0800 |
| 100+ | $19.4880 | $1,948.8000 |
| 1000+ | $18.3680 | $9,184.0000 |
| 10000+ | $16.8000 | $16,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||