
AMD Xilinx
XCS05XL-3VQG100C
XCS05XL-3VQG100C ECAD Model
XCS05XL-3VQG100C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 100 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 100 CLBS, 2000 GATES | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | TFQFP, | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS05XL-3VQG100C Datasheet Download
XCS05XL-3VQG100C Overview
The chip model XCS05XL-3VQG100C has become a popular choice in the semiconductor industry due to its high performance, low power consumption and cost-effectiveness. It is used in a variety of applications, from consumer electronics to industrial automation. The chip model is capable of performing complex tasks and can be used for a variety of applications, including communication networks, data processing, and image processing.
As technology evolves, the semiconductor industry is constantly looking for ways to improve the performance of the XCS05XL-3VQG100C chip model. This includes developing new technologies that can be used to optimize the chip model’s performance. For example, new techniques such as artificial intelligence and machine learning can be used to improve the chip model’s performance. Additionally, new technologies such as 5G networks can be used to improve the speed and reliability of the chip model.
The XCS05XL-3VQG100C chip model can also be used in intelligent scenarios. This includes applications such as autonomous vehicles, smart homes, and smart factories. In these scenarios, the chip model can be used to process data and make decisions in real-time. Additionally, the chip model can be used to control robots and other machines in industrial settings.
In addition to the applications mentioned above, the XCS05XL-3VQG100C chip model can also be used in the development and popularization of future intelligent robots. This includes robots that can be used in a variety of settings, such as healthcare, manufacturing, and education. In these settings, the chip model can be used to process data and make decisions in real-time. Additionally, the chip model can be used to control robots and other machines in industrial settings.
The use of the XCS05XL-3VQG100C chip model requires a certain level of technical expertise. This includes knowledge of computer programming, electronics, and robotics. Additionally, the chip model requires an understanding of the underlying technologies and algorithms used in the chip model. This includes knowledge of artificial intelligence, machine learning, and 5G networks.
In conclusion, the chip model XCS05XL-3VQG100C is a popular choice in the semiconductor industry due to its high performance, low power consumption, and cost-effectiveness. It can be used in a variety of applications, including communication networks, data processing, and image processing. Additionally, the chip model can be used in intelligent scenarios, such as autonomous vehicles, smart homes, and smart factories. Finally, the chip model can also be used in the development and popularization of future intelligent robots. To use the chip model effectively, technical expertise is required in areas such as computer programming, electronics, and robotics.
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