XCS05XL-3VQG100C
XCS05XL-3VQG100C
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rohs

AMD Xilinx

XCS05XL-3VQG100C


XCS05XL-3VQG100C
F20-XCS05XL-3VQG100C
Active
FIELD PROGRAMMABLE GATE ARRAY, TFQFP
TFQFP

XCS05XL-3VQG100C ECAD Model


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XCS05XL-3VQG100C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 2000
Number of CLBs 100
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 100 CLBS, 2000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description TFQFP,
Pin Count 100
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS05XL-3VQG100C Datasheet Download


XCS05XL-3VQG100C Overview



The chip model XCS05XL-3VQG100C has become a popular choice in the semiconductor industry due to its high performance, low power consumption and cost-effectiveness. It is used in a variety of applications, from consumer electronics to industrial automation. The chip model is capable of performing complex tasks and can be used for a variety of applications, including communication networks, data processing, and image processing.


As technology evolves, the semiconductor industry is constantly looking for ways to improve the performance of the XCS05XL-3VQG100C chip model. This includes developing new technologies that can be used to optimize the chip model’s performance. For example, new techniques such as artificial intelligence and machine learning can be used to improve the chip model’s performance. Additionally, new technologies such as 5G networks can be used to improve the speed and reliability of the chip model.


The XCS05XL-3VQG100C chip model can also be used in intelligent scenarios. This includes applications such as autonomous vehicles, smart homes, and smart factories. In these scenarios, the chip model can be used to process data and make decisions in real-time. Additionally, the chip model can be used to control robots and other machines in industrial settings.


In addition to the applications mentioned above, the XCS05XL-3VQG100C chip model can also be used in the development and popularization of future intelligent robots. This includes robots that can be used in a variety of settings, such as healthcare, manufacturing, and education. In these settings, the chip model can be used to process data and make decisions in real-time. Additionally, the chip model can be used to control robots and other machines in industrial settings.


The use of the XCS05XL-3VQG100C chip model requires a certain level of technical expertise. This includes knowledge of computer programming, electronics, and robotics. Additionally, the chip model requires an understanding of the underlying technologies and algorithms used in the chip model. This includes knowledge of artificial intelligence, machine learning, and 5G networks.


In conclusion, the chip model XCS05XL-3VQG100C is a popular choice in the semiconductor industry due to its high performance, low power consumption, and cost-effectiveness. It can be used in a variety of applications, including communication networks, data processing, and image processing. Additionally, the chip model can be used in intelligent scenarios, such as autonomous vehicles, smart homes, and smart factories. Finally, the chip model can also be used in the development and popularization of future intelligent robots. To use the chip model effectively, technical expertise is required in areas such as computer programming, electronics, and robotics.



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