AMD Xilinx
XCS05-3VQG100C
XCS05-3VQG100C ECAD Model
XCS05-3VQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 2000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 5000 | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS05-3VQG100C Datasheet Download
XCS05-3VQG100C Overview
The XCS05-3VQG100C chip model is the latest development from a leading semiconductor manufacturer. It has been designed to bring a new level of performance and flexibility to the industry. The chip model is designed to provide a range of features and benefits that make it suitable for a variety of applications.
The XCS05-3VQG100C is a high-performance, low-power chip model that is suitable for a variety of applications. It features a high-speed, low-power processor core, a large memory capacity, and a wide range of peripheral devices. The chip model also includes a number of unique features, such as a low-power, high-speed memory controller and an integrated power management system. This makes it well suited for use in a variety of applications, including high-speed communication systems, multimedia applications, and embedded systems.
The chip model is designed to be extremely flexible, allowing it to be used in a wide range of applications. It has been designed to be compatible with a number of different communication protocols, including Ethernet, Wi-Fi, and Bluetooth. It is also designed to be compatible with a number of different operating systems, including Windows, Linux, and Android. This makes it suitable for use in a wide range of applications, from consumer electronics to industrial automation.
The XCS05-3VQG100C is also designed to be easily upgradable, allowing it to be used in a variety of different applications. It is also designed to be compatible with a number of different intelligent systems, such as artificial intelligence, machine learning, and robotics. This makes it suitable for use in the era of fully intelligent systems, where it can be used to power a variety of different applications.
The chip model is expected to see an increasing demand in the future, as it is well suited for a variety of different applications. It is expected to be used in a wide range of applications, including high-speed communication systems, multimedia applications, and embedded systems. It is also expected to be used in a variety of intelligent scenarios, such as artificial intelligence, machine learning, and robotics. This makes it ideal for use in the era of fully intelligent systems, where it can be used to power a variety of different applications.
Overall, the XCS05-3VQG100C chip model is a powerful and flexible chip model that is well suited for a variety of applications. It is designed to be upgradable, allowing it to be used in a variety of different applications. It is also designed to be compatible with a number of different communication protocols and operating systems, making it suitable for use in a variety of different applications. Finally, it is expected to be used in a variety of intelligent scenarios, making it ideal for use in the era of fully intelligent systems.
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3,944 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9.2476 | $9.2476 |
| 10+ | $9.1482 | $91.4820 |
| 100+ | $8.6510 | $865.1019 |
| 1000+ | $8.1538 | $4,076.9170 |
| 10000+ | $7.4578 | $7,457.7750 |
| The price is for reference only, please refer to the actual quotation! | ||