AMD Xilinx
XCR5064C-7VQ100C
XCR5064C-7VQ100C ECAD Model
XCR5064C-7VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 7.5 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 105 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064C-7VQ100C Datasheet Download
XCR5064C-7VQ100C Overview
The XCR5064C-7VQ100C chip model is designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other related applications. It is an advanced and reliable model that enables users to easily program with HDL (Hardware Description Language). This chip model has several advantages that make it suitable for many applications.
First, the XCR5064C-7VQ100C chip model has a small form factor and is designed to fit into the tightest spaces. This makes it ideal for applications that require a small footprint. Furthermore, it has a high-speed clock frequency, which makes it suitable for high-speed processing tasks. Additionally, the chip model has a low power consumption, which makes it an attractive choice for applications that require low-power solutions.
In terms of future demand trends, the XCR5064C-7VQ100C chip model is expected to be increasingly sought after in the embedded, digital signal processing, and image processing industries. This is due to its robust performance and low power consumption. Additionally, the chip model is becoming increasingly popular for applications that require advanced communication systems. This is because the chip model is capable of supporting advanced communication protocols, such as Ethernet and Wi-Fi.
The original design intention of the XCR5064C-7VQ100C chip model was to provide a reliable and efficient solution for embedded, digital signal processing, and image processing applications. The chip model is designed to be upgradable, so it can keep up with the latest technology and trends. Furthermore, the chip model is capable of supporting advanced communication protocols, which makes it suitable for applications that require advanced communication systems.
In conclusion, the XCR5064C-7VQ100C chip model is a reliable and efficient solution for many applications. It is designed to fit into the tightest spaces, has a high-speed clock frequency, and has a low power consumption. Additionally, it is expected to be increasingly sought after in the embedded, digital signal processing, and image processing industries. Furthermore, the chip model is designed to be upgradable and capable of supporting advanced communication protocols. Therefore, it is suitable for applications that require advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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