
AMD Xilinx
XCR5064C-12PC44I
XCR5064C-12PC44I ECAD Model
XCR5064C-12PC44I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 12 ns | |
Number of Dedicated Inputs | 2 | |
Number of Macro Cells | 64 | |
Number of I/O Lines | 32 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2 DEDICATED INPUTS, 32 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 67 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQCC-J44 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 44 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC44,.7SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 16.5862 mm | |
Length | 16.5862 mm | |
Seated Height-Max | 4.57 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | QCCJ, LDCC44,.7SQ | |
Pin Count | 44 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCR5064C-12PC44I Datasheet Download
XCR5064C-12PC44I Overview
The chip model XCR5064C-12PC44I is a new product from a leading semiconductor manufacturer, designed to provide advanced communication systems with a powerful and reliable solution. With its impressive performance and comprehensive feature set, the XCR5064C-12PC44I is well-suited for a wide range of applications.
The original design intention of the XCR5064C-12PC44I was to provide a reliable and cost-effective solution for advanced communication systems. It is designed to provide high-speed, low-power and reliable communication, while also offering a wide range of features and functions. This chip model is capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. It also features an integrated memory controller, which allows for efficient data transfer and storage.
The XCR5064C-12PC44I is also capable of supporting future upgrades, allowing for further improvements in performance and features. This makes it an excellent choice for applications that require high-performance and reliable communication solutions. It is also possible to use this chip model in the era of fully intelligent systems, as it is capable of supporting a wide range of intelligent scenarios.
In terms of product description and specific design requirements, the XCR5064C-12PC44I features a 12-bit wide data bus, a 44-pin package, and a maximum frequency of 12MHz. This chip model is also designed to support a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. It also features an integrated memory controller, which allows for efficient data transfer and storage.
In order to ensure the best performance, it is important to consider the actual case studies and precautions when using the XCR5064C-12PC44I. For example, it is important to ensure that the chip model is properly powered and connected to the right communication protocols. It is also important to ensure that the chip model is correctly configured for the specific application. Finally, it is important to ensure that the chip model is properly cooled, as overheating can lead to reduced performance and reliability.
In conclusion, the XCR5064C-12PC44I is an excellent choice for advanced communication systems, offering a powerful and reliable solution. It is capable of supporting a wide range of communication protocols, and can be used in the era of fully intelligent systems. It is also capable of supporting future upgrades, allowing for further improvements in performance and features. When using this chip model, it is important to consider the actual case studies and precautions in order to ensure the best performance.
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QTY | Unit Price | Ext Price |
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