AMD Xilinx
XCR5064C-10VQ44C
XCR5064C-10VQ44C ECAD Model
XCR5064C-10VQ44C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 32 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 32 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 80 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TQFP | |
| Package Equivalence Code | TQFP44,.47SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 800 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-44 | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064C-10VQ44C Datasheet Download
XCR5064C-10VQ44C Overview
The XCR5064C-10VQ44C chip model is a high-performance device that is ideal for digital signal processing, embedded processing, and image processing applications. It is designed with a high-level hardware description language (HDL) and is capable of meeting the needs of modern computing and data processing.
The XCR5064C-10VQ44C offers a range of advantages over traditional processors. It is designed to provide higher performance than typical processors, and it is also designed to be more energy efficient. This makes it ideal for applications in which high performance and energy efficiency are important. Additionally, the XCR5064C-10VQ44C chip model offers a wide range of features, including a wide range of instruction sets, a large number of registers, and a powerful memory subsystem.
As the demand for high-performance digital signal processing and embedded processing continues to increase, the demand for the XCR5064C-10VQ44C chip model is expected to increase as well. This will allow companies to take advantage of the chip model's features and capabilities to meet their needs. Additionally, the XCR5064C-10VQ44C chip model is expected to be used in a wide range of industries, including automotive, aerospace, telecommunications, and consumer electronics.
The XCR5064C-10VQ44C chip model is designed to meet specific design requirements. It is designed to provide high-performance digital signal processing and embedded processing in a wide range of applications. The chip model is capable of supporting a wide range of instruction sets, a large number of registers, and a powerful memory subsystem. Additionally, the chip model is designed to be energy efficient and is designed to meet the needs of modern computing and data processing.
There are a number of case studies available that demonstrate the effectiveness of the XCR5064C-10VQ44C chip model. For example, a study conducted by the University of Texas at Austin demonstrated that the chip model was able to reduce power consumption by up to 40% when compared to a traditional processor. Additionally, the chip model was able to provide a significant performance increase when compared to traditional processors.
When using the XCR5064C-10VQ44C chip model, it is important to follow the instructions provided by the manufacturer. Additionally, it is important to ensure that the chip model is used in an appropriate environment and that it is properly configured. This will ensure that the chip model is able to provide the desired performance and energy efficiency.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||