AMD Xilinx
XCR5064C-10VQ100I
XCR5064C-10VQ100I ECAD Model
XCR5064C-10VQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 77 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064C-10VQ100I Datasheet Download
XCR5064C-10VQ100I Overview
The XCR5064C-10VQ100I chip model is a high-performance integrated circuit designed by Xilinx Corporation, which is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it a powerful tool for developers.
The original design intention of the XCR5064C-10VQ100I chip model was to provide a high-performance integrated circuit that could be used for a variety of tasks. It is designed to be flexible and upgradeable, so that it can be used for a variety of applications. It is also designed to be used in advanced communication systems, making it a powerful tool for developers working on these systems.
The XCR5064C-10VQ100I chip model can also be used in the development and popularization of future intelligent robots. It can be used to create powerful and efficient robots that are capable of performing complex tasks. To use the model effectively, developers need to have a good understanding of HDL language and be familiar with the various features of the chip model.
In conclusion, the XCR5064C-10VQ100I chip model is a powerful and versatile integrated circuit that can be used for a variety of applications. It is designed to be upgradeable and can be used in advanced communication systems. It can also be used in the development and popularization of future intelligent robots. To use the model effectively, developers need to have a good understanding of HDL language and be familiar with the various features of the chip model.
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