AMD Xilinx
XCR5064C-10PC44I
XCR5064C-10PC44I ECAD Model
XCR5064C-10PC44I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 32 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 32 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 77 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 16.5862 mm | |
| Length | 16.5862 mm | |
| Seated Height-Max | 4.57 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC44,.7SQ | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064C-10PC44I Datasheet Download
XCR5064C-10PC44I Overview
The XCR5064C-10PC44I chip model is a high-performance and cost-effective product developed by a leading semiconductor company. It is designed to meet the needs of various industries, such as consumer electronics, automotive, industrial, and communication systems. The chip model has a number of advantages, including low power consumption, high speed, and a wide range of applications.
The XCR5064C-10PC44I chip model is based on the latest technology and is designed to meet the needs of the most demanding applications. It is designed to be highly reliable and to provide high performance with minimal power consumption. The chip model is capable of supporting a variety of communication systems, such as Ethernet, Wi-Fi, and Bluetooth, and can be used in a wide range of applications, from consumer electronics to automotive and industrial applications.
The XCR5064C-10PC44I chip model is designed with a number of features, including a low-power core, an integrated memory controller, and an advanced digital signal processor. It is capable of supporting a wide range of data rates, from 10Mbps to 10Gbps, and is designed to be highly reliable and efficient. The chip model is also designed to be easily upgradable, allowing for future upgrades to meet the needs of the most demanding applications.
The XCR5064C-10PC44I chip model is expected to experience increased demand in the future, as more applications are developed that require the chip model's performance and reliability. The chip model is also expected to be used in more advanced communication systems, such as 5G and beyond. As such, the chip model is expected to become increasingly popular in the coming years.
The product description of the XCR5064C-10PC44I chip model includes detailed specifications and design requirements. It includes a detailed description of the chip model's features, such as its low-power core, integrated memory controller, and advanced digital signal processor. It also includes information about the chip model's compatibility with various communication systems, such as Ethernet, Wi-Fi, and Bluetooth. Additionally, the product description includes information about the chip model's upgradability, as well as its expected performance and reliability.
Case studies of the XCR5064C-10PC44I chip model have been conducted in a variety of industries, including consumer electronics, automotive, industrial, and communication systems. These studies have demonstrated the chip model's performance and reliability, as well as its ability to meet the needs of a variety of applications. Additionally, these studies have provided valuable information about the chip model's upgradability, as well as its compatibility with various communication systems.
When using the XCR5064C-10PC44I chip model, it is important to take certain precautions. It is important to ensure that the chip model is properly installed and configured, and that it is compatible with the desired communication system. Additionally, it is important to ensure that the chip model is regularly tested and maintained to ensure its performance and reliability.
In conclusion, the XCR5064C-10PC44I chip model is a high-performance and cost-effective product designed to meet the needs of various industries. It is designed with a number of features, including a low-power core, an integrated memory controller, and an advanced digital signal processor. The chip model is expected to experience increased demand in the future, as more applications are developed that require its performance and reliability. Additionally, it is designed to be easily upgradable, allowing for future upgrades to meet the needs of the most demanding applications. The product description of the chip model includes detailed specifications and design requirements, and case studies have demonstrated its performance and reliability. When using the chip model, it is important to take certain precautions to ensure its performance and reliability.
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