AMD Xilinx
XCR5064C-10PC44C
XCR5064C-10PC44C ECAD Model
XCR5064C-10PC44C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 32 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 32 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 80 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 16.5862 mm | |
| Length | 16.5862 mm | |
| Seated Height-Max | 4.57 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC44,.7SQ | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064C-10PC44C Datasheet Download
XCR5064C-10PC44C Overview
The XCR5064C-10PC44C is a powerful chip model developed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language used to create and simulate digital logic designs.
This chip model has been widely used in various industries, such as automotive, aerospace, medical, and consumer electronics. It is a high-performance, low-power, and cost-effective solution for many applications. Its original design intention was to provide a reliable and efficient solution for advanced communication systems.
The XCR5064C-10PC44C is a highly integrated chip model that has a wide range of features and functions. It can be used for various applications, such as digital signal processing, embedded processing, image processing, and more. It is also capable of providing high-speed data transfer, low-power consumption, and high-precision performance.
The industry trends for the chip model XCR5064C-10PC44C are constantly changing as new technologies are being developed and implemented. To ensure that the chip model is able to keep up with the latest industry trends and remain competitive, it is important to keep up with the latest technologies and ensure that the application environment is able to support them.
The XCR5064C-10PC44C is designed to be highly upgradable and can be used for advanced communication systems. Its upgradability allows it to remain up-to-date and capable of performing more complex tasks. It is also capable of providing high-speed data transfer, low-power consumption, and high-precision performance.
Overall, the XCR5064C-10PC44C is a powerful chip model that is suitable for a wide range of applications. It is designed to be used with HDL language and is capable of providing high-speed data transfer, low-power consumption, and high-precision performance. It is highly upgradable and can be used for advanced communication systems. As new technologies are being developed, it is important to keep up with the latest industry trends and ensure that the application environment is able to support them.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||