AMD Xilinx
XCR5064-7PQ100C
XCR5064-7PQ100C ECAD Model
XCR5064-7PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 7.5 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | NO | |
| Clock Frequency-Max | 105 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064-7PQ100C Datasheet Download
XCR5064-7PQ100C Overview
The XCR5064-7PQ100C chip model is a versatile and reliable integrated circuit (IC) designed to provide a wide variety of features and functions. Its original design intention was to provide a cost-effective and efficient solution for the development and popularization of advanced communication systems. It is a low-power, high-performance, and highly integrated device that can be used in a variety of applications.
The XCR5064-7PQ100C chip model includes an array of features and functions that enable it to be used in a wide range of applications. It includes an on-chip memory and an embedded processor core, providing a low-power and high-performance solution. It also includes an advanced power management system, allowing for efficient power management and a wide range of operating modes. It is also designed to provide a high level of integration, allowing for the integration of multiple components into a single package.
The XCR5064-7PQ100C chip model is designed to be used in a variety of applications, including advanced communication systems. It is capable of providing high-speed data transmission and reception, as well as high-speed data processing. It is also designed to provide a wide range of features and functions, such as high-speed data encryption and decryption, as well as support for a variety of protocols. Additionally, it is designed to provide a high level of integration, allowing for the integration of multiple components into a single package.
The XCR5064-7PQ100C chip model is also designed to be upgradable, allowing for future upgrades and enhancements. It is also designed to be compatible with a variety of operating systems, allowing for the development and popularization of advanced communication systems. Additionally, it is also designed to be compatible with a variety of intelligent robots, allowing for the development and popularization of future intelligent robots.
In order to effectively use the XCR5064-7PQ100C chip model, it is important to understand the product description and specific design requirements. Additionally, it is important to understand the actual case studies and precautions associated with the chip model. Additionally, it is important to understand the technical talents and skills necessary to effectively use the chip model. This includes a thorough understanding of the underlying technology, as well as the ability to design and implement the chip model in a variety of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||