AMD Xilinx
XCR5064-12VQ44I
XCR5064-12VQ44I ECAD Model
XCR5064-12VQ44I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 12 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 32 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 32 I/O | |
| Additional Feature | NO | |
| Clock Frequency-Max | 67 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TQFP | |
| Package Equivalence Code | TQFP44,.47SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 800 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TQFP, TQFP44,.47SQ,32 | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064-12VQ44I Datasheet Download
XCR5064-12VQ44I Overview
The XCR5064-12VQ44I chip model is a high-performance digital signal processor (DSP) that is suitable for embedded processing, image processing, and other applications. It is designed to be used with the HDL (Hardware Description Language) language, allowing for greater flexibility in the design of the circuit.
The XCR5064-12VQ44I chip model is part of a growing trend in the industry for high-performance DSPs. As the demand for more powerful and efficient DSPs increases, the XCR5064-12VQ44I chip model is well placed to meet this demand. It is important to note that, while the XCR5064-12VQ44I chip model is suitable for a wide range of applications, it may be necessary to use new technologies in order to fully exploit its potential.
In order to ensure the successful design and implementation of the XCR5064-12VQ44I chip model, it is important to understand its product description and design requirements. This includes the type of HDL language to be used, the specific features of the chip, and any additional components that may be required. It is also important to consider any potential issues that may arise during the design process, as well as any particular precautions that need to be taken during the implementation of the chip model.
Case studies of the XCR5064-12VQ44I chip model can provide useful insight into the design process. These case studies can be helpful in understanding the potential challenges that may arise, as well as any potential solutions. This can help to ensure that the chip model is designed and implemented in a way that is both efficient and effective.
In conclusion, the XCR5064-12VQ44I chip model is a powerful and efficient DSP that is suitable for a wide range of applications. It is important to understand the product description and design requirements, as well as any potential issues that may arise during the design and implementation process. Case studies can provide useful insight into the design process, and can help to ensure that the chip model is designed and implemented correctly.
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|---|---|---|
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