AMD Xilinx
XCR5064-10PQ100I
XCR5064-10PQ100I ECAD Model
XCR5064-10PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | NO | |
| Clock Frequency-Max | 77 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5064-10PQ100I Datasheet Download
XCR5064-10PQ100I Overview
The chip model XCR5064-10PQ100I is a high-performance, low-power, and cost-effective solution for a wide range of applications. It is designed to provide high levels of integration and flexibility, enabling the development of advanced and complex systems. The model is based on a 32-bit RISC architecture, and is capable of supporting various communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and ZigBee.
The chip model XCR5064-10PQ100I offers several advantages that make it an attractive option for embedded system applications. It is designed to be power-efficient and has an integrated power management unit, allowing the device to run at a low power level while still providing high performance. The model also has a wide range of peripheral interfaces, including USB, I2C, SPI, and UART, as well as an integrated memory controller. This makes it suitable for a variety of applications, including industrial automation, consumer electronics, and automotive systems.
The chip model XCR5064-10PQ100I is expected to be increasingly in demand in the future, as the need for low-power, high-performance solutions for embedded systems continues to grow. The model is also suitable for use in advanced communication systems, as it supports a wide range of communication protocols. The model is also designed to be easily upgradable, allowing it to remain up to date with the latest technologies.
In conclusion, the chip model XCR5064-10PQ100I is a powerful and cost-effective solution for embedded systems applications. It offers a wide range of features and interfaces, making it suitable for a variety of applications. The model is also designed to be easily upgradable, allowing it to remain up to date with the latest technologies. Furthermore, the model is expected to be increasingly in demand in the future, as the need for low-power, high-performance solutions for embedded systems continues to grow.
You May Also Be Interested In
4,826 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||