XCR5064-10PQ100C
XCR5064-10PQ100C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCR5064-10PQ100C


XCR5064-10PQ100C
F20-XCR5064-10PQ100C
Active
EE PLD, 10 ns, 64-Cell, CMOS, PLASTIC, QFP-100
PLASTIC, QFP-100

XCR5064-10PQ100C ECAD Model


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XCR5064-10PQ100C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 10 ns
Number of Dedicated Inputs 2
Number of Macro Cells 64
Number of I/O Lines 64
Programmable Logic Type EE PLD
Temperature Grade COMMERCIAL
Package Shape RECTANGULAR
Technology CMOS
Organization 2 DEDICATED INPUTS, 64 I/O
Additional Feature NO
Clock Frequency-Max 77 MHz
In-System Programmable NO
JTAG BST NO
Output Function MACROCELL
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 14 mm
Length 20 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description PLASTIC, QFP-100
Pin Count 100
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCR5064-10PQ100C Datasheet Download


XCR5064-10PQ100C Overview



The XCR5064-10PQ100C chip model is a high-performance, low-power chip developed by the Xilinx Corporation. It is designed to meet the needs of the modern communications industry and provides a wide range of features and capabilities.


The XCR5064-10PQ100C chip model is based on a flexible, multi-purpose architecture that allows for easy integration into existing systems. It is an ideal solution for a wide range of applications including wireless communications, consumer electronics, and automotive systems. It is also suitable for use in advanced communication systems such as 5G networks.


The XCR5064-10PQ100C chip model is designed to provide a high level of performance and reliability. It is designed to be able to handle large amounts of data quickly and efficiently. It is also designed to be compatible with a variety of different operating systems and protocols.


The XCR5064-10PQ100C chip model is capable of supporting a variety of intelligent scenarios, including machine learning and artificial intelligence. It is also capable of being used in the era of fully intelligent systems, such as autonomous vehicles and smart homes.


The XCR5064-10PQ100C chip model is designed to meet the specific needs of different customers. It is designed to be compatible with a variety of different hardware platforms and applications. It is also designed to be highly reliable and provide a high level of performance.


When designing and implementing the XCR5064-10PQ100C chip model, it is important to consider the product description and specific design requirements. It is also important to consider actual case studies and precautions when using the chip model.


The XCR5064-10PQ100C chip model is designed to provide a high level of performance and reliability. It is also designed to be able to handle large amounts of data quickly and efficiently. With its flexible architecture, it is an ideal solution for a wide range of applications and can be used in advanced communication systems such as 5G networks. Furthermore, it is capable of supporting a variety of intelligent scenarios and can be used in the era of fully intelligent systems. When designing and implementing the XCR5064-10PQ100C chip model, it is important to consider the product description and specific design requirements, as well as actual case studies and precautions.



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