
AMD Xilinx
XCR5064-10PQ100C
XCR5064-10PQ100C ECAD Model
XCR5064-10PQ100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 10 ns | |
Number of Dedicated Inputs | 2 | |
Number of Macro Cells | 64 | |
Number of I/O Lines | 64 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 2 DEDICATED INPUTS, 64 I/O | |
Additional Feature | NO | |
Clock Frequency-Max | 77 MHz | |
In-System Programmable | NO | |
JTAG BST | NO | |
Output Function | MACROCELL | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | R-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP100,.7X.9 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | PLASTIC, QFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCR5064-10PQ100C Datasheet Download
XCR5064-10PQ100C Overview
The XCR5064-10PQ100C chip model is a high-performance, low-power chip developed by the Xilinx Corporation. It is designed to meet the needs of the modern communications industry and provides a wide range of features and capabilities.
The XCR5064-10PQ100C chip model is based on a flexible, multi-purpose architecture that allows for easy integration into existing systems. It is an ideal solution for a wide range of applications including wireless communications, consumer electronics, and automotive systems. It is also suitable for use in advanced communication systems such as 5G networks.
The XCR5064-10PQ100C chip model is designed to provide a high level of performance and reliability. It is designed to be able to handle large amounts of data quickly and efficiently. It is also designed to be compatible with a variety of different operating systems and protocols.
The XCR5064-10PQ100C chip model is capable of supporting a variety of intelligent scenarios, including machine learning and artificial intelligence. It is also capable of being used in the era of fully intelligent systems, such as autonomous vehicles and smart homes.
The XCR5064-10PQ100C chip model is designed to meet the specific needs of different customers. It is designed to be compatible with a variety of different hardware platforms and applications. It is also designed to be highly reliable and provide a high level of performance.
When designing and implementing the XCR5064-10PQ100C chip model, it is important to consider the product description and specific design requirements. It is also important to consider actual case studies and precautions when using the chip model.
The XCR5064-10PQ100C chip model is designed to provide a high level of performance and reliability. It is also designed to be able to handle large amounts of data quickly and efficiently. With its flexible architecture, it is an ideal solution for a wide range of applications and can be used in advanced communication systems such as 5G networks. Furthermore, it is capable of supporting a variety of intelligent scenarios and can be used in the era of fully intelligent systems. When designing and implementing the XCR5064-10PQ100C chip model, it is important to consider the product description and specific design requirements, as well as actual case studies and precautions.
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