AMD Xilinx
XCR5064-10PC84C
XCR5064-10PC84C ECAD Model
XCR5064-10PC84C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | NO | |
| Clock Frequency-Max | 77 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCR5064-10PC84C Datasheet Download
XCR5064-10PC84C Overview
The XCR5064-10PC84C chip model is a powerful and versatile processor designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with the HDL language, a hardware description language that is used to program integrated circuits.
The XCR5064-10PC84C chip model is a powerful tool for both designers and engineers. It offers a wide range of features and capabilities that make it suitable for a variety of applications. It has a high clock speed, low power consumption, and low latency, making it ideal for applications that require high performance and low power consumption. Additionally, the chip model's architecture allows for easy scalability, which makes it suitable for applications that require a high degree of customization.
The XCR5064-10PC84C chip model has been designed with the future in mind. Its architecture allows for future upgrades and enhancements, making it a great choice for applications that require advanced communication systems. Additionally, the chip model is designed to be compatible with a wide range of software and hardware tools, making it an ideal choice for applications that require a high degree of customization.
In terms of future demand, the XCR5064-10PC84C chip model is expected to remain in demand as the need for high-performance digital signal processing, embedded processing, and image processing continues to grow. Furthermore, the chip model's architecture allows for easy scalability and future upgrades, making it a great choice for applications that require advanced communication systems.
In conclusion, the XCR5064-10PC84C chip model is a powerful and versatile processor that is suitable for a variety of applications. It offers a wide range of features and capabilities that make it suitable for high-performance digital signal processing, embedded processing, and image processing. Additionally, its architecture allows for easy scalability and future upgrades, making it an ideal choice for applications that require advanced communication systems. As the need for these types of applications continues to grow, the XCR5064-10PC84C chip model is expected to remain in demand.
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|---|---|---|
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