AMD Xilinx
XCR3256XL-12TQ144Q
XCR3256XL-12TQ144Q ECAD Model
XCR3256XL-12TQ144Q Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 120 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 120 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR3256XL-12TQ144Q Datasheet Download
XCR3256XL-12TQ144Q Overview
The XCR3256XL-12TQ144Q chip model is a high-performance model from Xilinx, a leading provider of programmable logic devices. It is a field programmable gate array (FPGA) that is suitable for various applications such as high-performance digital signal processing, embedded processing, and image processing. This chip model requires the use of HDL language for programming, which is a hardware description language used in the design of digital systems.
The XCR3256XL-12TQ144Q chip model has several advantages that make it a preferred choice for many applications. It is highly configurable and can be used for a wide range of applications. The chip model also offers excellent performance, with a high-speed data transfer rate and low power consumption. Additionally, the chip model is highly reliable and features a long service life.
The demand for the XCR3256XL-12TQ144Q chip model is expected to grow in the future, particularly in the fields of digital signal processing, embedded processing, and image processing. The chip model is ideal for these applications due to its high configurability, excellent performance, and low power consumption. In addition, the chip model is also expected to be used in the development and popularization of future intelligent robots.
To use the XCR3256XL-12TQ144Q chip model effectively, it is important to have the right technical skills. Knowledge of HDL language is essential for programming the chip model, as this is the language used to design digital systems. Additionally, knowledge of digital signal processing, embedded processing, and image processing is also important for utilizing the chip model’s capabilities to the fullest. With the right technical skills, the XCR3256XL-12TQ144Q chip model can be used to develop and popularize future intelligent robots.
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3,814 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $18.3366 | $18.3366 |
| 10+ | $18.1395 | $181.3946 |
| 100+ | $17.1536 | $1,715.3616 |
| 1000+ | $16.1678 | $8,083.8880 |
| 10000+ | $14.7876 | $14,787.6000 |
| The price is for reference only, please refer to the actual quotation! | ||