
AMD Xilinx
XCR3064A-7VQ44C
XCR3064A-7VQ44C ECAD Model
XCR3064A-7VQ44C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Propagation Delay | 7.5 ns | |
Number of Dedicated Inputs | 2 | |
Number of Macro Cells | 64 | |
Number of I/O Lines | 32 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2 DEDICATED INPUTS, 32 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 111 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G44 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 44 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TQFP | |
Package Equivalence Code | TQFP44,.47SQ,32 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 800 µm | |
Terminal Position | QUAD | |
Width | 10 mm | |
Length | 10 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | TQFP, TQFP44,.47SQ,32 | |
Pin Count | 44 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCR3064A-7VQ44C Datasheet Download
XCR3064A-7VQ44C Overview
The chip model XCR3064A-7VQ44C is an advanced integrated circuit designed by Xilinx Inc. It is a programmable logic device that is widely used in various fields such as communications, industrial control, and consumer electronics. This chip model can be used to design digital logic circuits, such as logic gates, counters, and registers, and can also be used to create complex digital systems.
The XCR3064A-7VQ44C chip model is designed to be highly reliable and efficient. It is capable of handling large amounts of data, and can be used in a variety of applications. It is also designed to be easily upgradable, allowing for future expansion and development.
In terms of industry trends, the XCR3064A-7VQ44C chip model is being increasingly used in communication systems, industrial control systems, and consumer electronics. It is also being used in the development of intelligent systems, such as robotics and artificial intelligence. This chip model is also being used in the development of advanced networks and communication systems, such as 5G networks.
The XCR3064A-7VQ44C chip model is also being used in the development of intelligent systems, such as robotics and artificial intelligence. This chip model is capable of supporting a wide range of applications, such as voice recognition, image processing, and machine learning. It is also capable of supporting the development of fully intelligent systems, such as the Internet of Things (IoT) and autonomous vehicles.
The XCR3064A-7VQ44C chip model is also being used in the development of advanced networks and communication systems, such as 5G networks. This chip model is capable of supporting the development of advanced networks and communication systems, such as 5G networks. It is also capable of supporting the development of advanced communication systems, such as the Internet of Things (IoT) and autonomous vehicles.
In conclusion, the XCR3064A-7VQ44C chip model is an advanced integrated circuit designed by Xilinx Inc. It is highly reliable and efficient and is capable of handling large amounts of data. It is being increasingly used in communication systems, industrial control systems, and consumer electronics. It is also being used in the development of intelligent systems, such as robotics and artificial intelligence. It is also capable of supporting the development of advanced networks and communication systems, such as 5G networks. It is also capable of supporting the development of fully intelligent systems, such as the Internet of Things (IoT) and autonomous vehicles.
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