AMD Xilinx
XCR3064A-7VQ100C
XCR3064A-7VQ100C ECAD Model
XCR3064A-7VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 7.5 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 111 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR3064A-7VQ100C Datasheet Download
XCR3064A-7VQ100C Overview
The XCR3064A-7VQ100C chip model is a game-changing technology that has the potential to revolutionize the way networks are managed and intelligent systems are developed. This chip model is a powerful tool that has the ability to enable the development of intelligent scenarios and applications in a variety of industries. It is designed to provide a comprehensive solution for network management and intelligent system development, allowing users to quickly and easily develop and deploy their own intelligent systems.
The XCR3064A-7VQ100C chip model is designed with a wide range of features and capabilities. It provides support for a variety of communication protocols, including Ethernet, Wi-Fi, and Bluetooth, as well as a wide range of system-level programming languages. It also has an integrated FPGA and a variety of input/output ports, allowing it to be used for a variety of applications. Additionally, the chip model includes a variety of safety and security features, such as secure boot and authentication, as well as support for secure communication protocols.
The XCR3064A-7VQ100C chip model can be used to develop and deploy a variety of intelligent systems, from industrial automation and robotics to intelligent home and building systems. It can also be used to develop and deploy intelligent robots and other intelligent systems for the home, office, and other applications. In addition, the chip model can be used to create intelligent systems for the development and popularization of future intelligent robots.
In order to effectively use the XCR3064A-7VQ100C chip model, users need to have a good understanding of the features and capabilities of the chip model, as well as the programming languages and protocols that it supports. Additionally, users should be familiar with the safety and security features of the chip model, as well as the best practices for developing and deploying intelligent systems. There are a variety of resources available to help users in this regard, including online tutorials and case studies.
The XCR3064A-7VQ100C chip model is a powerful tool that has the potential to revolutionize the way networks are managed and intelligent systems are developed. It can be used to create a variety of intelligent systems and applications, and is a great tool for the development and popularization of future intelligent robots. With the right knowledge and resources, users can leverage the features and capabilities of this chip model to create and deploy their own intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||