AMD Xilinx
XCR3064A-10VQ100I
XCR3064A-10VQ100I ECAD Model
XCR3064A-10VQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 90 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3/3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR3064A-10VQ100I Datasheet Download
XCR3064A-10VQ100I Overview
The XCR3064A-10VQ100I is a powerful chip model designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and more. It is a versatile chip model that can be used in a wide range of applications, from simple communication systems to more advanced applications.
The chip model was designed with the intention of providing a reliable and efficient solution to the ever-growing demand for high-performance digital signal processing. It is capable of handling complex tasks such as image processing and embedded processing, and can be programmed using the HDL language. This makes it an ideal choice for applications that require a high degree of flexibility and performance.
The XCR3064A-10VQ100I is also capable of being upgraded in the future. It has the potential to be used in advanced communication systems, such as those used in networks or intelligent scenarios. This makes it ideal for applications that require a high degree of intelligence and flexibility.
The XCR3064A-10VQ100I is also well-suited to the demands of the modern era, where fully intelligent systems are becoming increasingly common. It is capable of handling complex tasks, such as image recognition, natural language processing, and more. This makes it an ideal choice for applications that require a high degree of intelligence and performance.
In conclusion, the XCR3064A-10VQ100I is a powerful and versatile chip model that is capable of meeting the needs of a wide range of applications. It is designed to provide reliable and efficient solutions for high-performance digital signal processing, embedded processing, image processing, and more. It is also capable of being upgraded in the future and can be used in advanced communication systems and intelligent scenarios. This makes it an ideal choice for applications that require a high degree of intelligence and flexibility.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||