AMD Xilinx
XCR3064A-10VQ100C
XCR3064A-10VQ100C ECAD Model
XCR3064A-10VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 83 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR3064A-10VQ100C Datasheet Download
XCR3064A-10VQ100C Overview
The XCR3064A-10VQ100C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language to be used effectively. As such, the industry trends of the chip model and the future development of related industries will depend on the specific technologies that are needed to support the application environment.
The XCR3064A-10VQ100C chip model has the potential to be used in the development and popularization of future intelligent robots. To use the model effectively, technical talents with a diverse set of skills are needed. This includes knowledge of HDL language, as well as knowledge of the specific technologies used in the application environment. In addition, knowledge of robotics and artificial intelligence is also required, as these technologies are essential to the development of intelligent robots.
In conclusion, the XCR3064A-10VQ100C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is also capable of being used in the development and popularization of future intelligent robots, provided that the right technical talents are employed. To use the model effectively, knowledge of HDL language, the specific technologies used in the application environment, and robotics and artificial intelligence are all essential.
You May Also Be Interested In
5,743 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||