AMD Xilinx
XCR3032C-8VQ44C
XCR3032C-8VQ44C ECAD Model
XCR3032C-8VQ44C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 8 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 32 | |
| Number of I/O Lines | 32 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 32 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 91 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.63 V | |
| Supply Voltage-Min | 2.97 V | |
| JESD-30 Code | S-PQFP-G44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TQFP | |
| Package Equivalence Code | TQFP44,.47SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 800 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TQFP, TQFP44,.47SQ,32 | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR3032C-8VQ44C Datasheet Download
XCR3032C-8VQ44C Overview
The XCR3032C-8VQ44C chip model is a high-performance integrated circuit designed to meet the needs of digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, which is a high-level language designed specifically for hardware design. This chip model is a powerful tool for developing efficient and reliable digital systems.
The industry trends of the chip model XCR3032C-8VQ44C and the future development of related industries depend on the specific technologies needed for its application. The chip model is capable of performing complex calculations and can be used in various intelligent scenarios. It can be used in networks and can be applied to fully intelligent systems. It is also capable of handling large amounts of data and can be used for real-time analysis and decision making.
The XCR3032C-8VQ44C chip model is a powerful tool for developing digital systems and can be used in various scenarios. It is capable of performing complex calculations and can be used in networks and intelligent systems. It is also capable of handling large amounts of data and can be used for real-time analysis and decision making. By leveraging the power of this chip model, developers can create more efficient and reliable digital systems.
The XCR3032C-8VQ44C chip model is a powerful tool for developing digital systems and can be used in various scenarios. It is capable of performing complex calculations and can be used in networks and intelligent systems. It is also capable of handling large amounts of data and can be used for real-time analysis and decision making. With the increasing demand for digital systems and intelligent systems, the chip model XCR3032C-8VQ44C is expected to become more popular and will be used in more and more applications. With its power and features, it can help developers create more efficient and reliable digital systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||