XCR22V10-10VO24I
XCR22V10-10VO24I
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rohs

AMD Xilinx

XCR22V10-10VO24I


XCR22V10-10VO24I
F20-XCR22V10-10VO24I
Active
EE PLD, 10 ns, CMOS, TSSOP
TSSOP

XCR22V10-10VO24I ECAD Model


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XCR22V10-10VO24I Attributes


Type Description Select
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 10 ns
Number of Dedicated Inputs 11
Number of I/O Lines 10
Programmable Logic Type EE PLD
Temperature Grade INDUSTRIAL
Package Shape RECTANGULAR
Technology CMOS
Organization 11 DEDICATED INPUTS, 10 I/O
Clock Frequency-Max 74 MHz
Output Function MACROCELL
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code R-PDSO-G24
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Number of Terminals 24
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Surface Mount YES
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position DUAL
Width 4.4 mm
Length 7.8 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code SOIC
Package Description TSSOP,
Pin Count 24
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XCR22V10-10VO24I Datasheet Download


XCR22V10-10VO24I Overview



The XCR22V10-10VO24I chip model is a powerful and versatile integrated circuit that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in HDL language and offers a wide range of features that make it suitable for advanced communication systems.


The original design intention of the XCR22V10-10VO24I chip model was to provide users with a reliable and efficient solution for their digital signal processing, embedded processing, and image processing needs. The chip model is designed to be easily upgradable, allowing users to take advantage of future technological advancements without having to replace their existing hardware. This makes the XCR22V10-10VO24I an efficient and cost-effective solution for users looking to stay ahead of the curve.


The product description of the XCR22V10-10VO24I chip model includes a number of features that make it a valuable addition to any digital signal processing, embedded processing, or image processing system. It has a high-speed clock frequency of up to 25MHz and a wide range of I/O options, allowing it to be used in a variety of configurations. The chip model also offers advanced power management capabilities, allowing it to be used in low-power applications. Additionally, the XCR22V10-10VO24I is designed to be compatible with a variety of software development environments, making it easy to integrate into existing systems.


To ensure the best possible performance from the XCR22V10-10VO24I chip model, it is important to understand the design requirements and take into account any potential issues that may arise. For example, the chip model should be used in a clean environment to ensure that it does not become contaminated with dust or other contaminants. Additionally, it is important to ensure that the power supply is stable to prevent any potential power surges or drops. Finally, it is important to ensure that the chip model is properly programmed and that any necessary updates are applied to keep it running optimally.


To demonstrate the effectiveness of the XCR22V10-10VO24I chip model, a number of case studies have been conducted. These studies have shown that the chip model is capable of providing reliable and efficient performance in a variety of applications. For example, one study showed that the chip model was able to process digital signals with a speed of up to 25MHz, while another study showed that it was able to accurately process images with a resolution of up to 1024x768 pixels.


In conclusion, the XCR22V10-10VO24I chip model is a powerful and versatile integrated circuit that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in HDL language and offers a wide range of features that make it suitable for advanced communication systems. To ensure the best possible performance from the chip model, it is important to understand the design requirements and take into account any potential issues that may arise. Additionally, a number of case studies have been conducted to demonstrate the effectiveness of the chip model in a variety of applications.



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