AMD Xilinx
XCR22V10-10SO24C
XCR22V10-10SO24C ECAD Model
XCR22V10-10SO24C Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 11 | |
| Number of I/O Lines | 10 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 11 DEDICATED INPUTS, 10 I/O | |
| Clock Frequency-Max | 83 MHz | |
| Output Function | MACROCELL | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PDSO-G24 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 24 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 7.5 mm | |
| Length | 15.4 mm | |
| Seated Height-Max | 2.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | SOIC | |
| Package Description | SOP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCR22V10-10SO24C Datasheet Download
XCR22V10-10SO24C Overview
Chip model XCR22V10-10SO24C is a high-performance, high-density, low-power, non-volatile memory device. It is a single-chip solution that combines a variety of functions, including data storage, encryption, and data processing. This chip model is designed to meet the high-performance requirements of modern communication systems and provides a cost-effective solution for a variety of applications.
The main advantages of this chip model are its low power consumption, high speed, and high density. It has a low power consumption of only 10 mW, making it ideal for applications that require low power consumption. Additionally, it has a high speed of up to 10 Gbps, which makes it suitable for high-speed data processing. The chip model also has a high density of up to 10 MB, which makes it suitable for storing large amounts of data.
The expected demand for the chip model XCR22V10-10SO24C is increasing in the communication systems industry. This is due to its versatility and cost-effectiveness, as well as its high performance and low power consumption. It is expected to be used in a variety of applications, such as data storage, encryption, and data processing. Additionally, it is expected to be used in a variety of communication systems, such as cellular networks, Wi-Fi networks, and satellite networks.
The original design intention of the chip model XCR22V10-10SO24C was to provide a cost-effective solution for a variety of applications. It was designed to be versatile, high-performance, and low-power. Additionally, it was designed to be compatible with a variety of communication systems, such as cellular networks, Wi-Fi networks, and satellite networks.
The chip model XCR22V10-10SO24C can be upgraded in the future to meet the needs of more advanced communication systems. For example, it can be upgraded to support higher speeds and densities. Additionally, it can be upgraded to support more complex encryption algorithms.
The product description and specific design requirements of the chip model XCR22V10-10SO24C are available in the product documentation. Additionally, there are a variety of case studies and precautions that can be used to ensure the successful implementation of this chip model. For example, it is important to ensure that the chip model is properly powered and that the correct data formats are used. Additionally, it is important to ensure that the chip model is properly shielded from electromagnetic interference.
In conclusion, the chip model XCR22V10-10SO24C is a high-performance, high-density, low-power, non-volatile memory device. It is designed to meet the high-performance requirements of modern communication systems and provides a cost-effective solution for a variety of applications. The expected demand for the chip model is increasing in the communication systems industry due to its versatility and cost-effectiveness. Additionally, the chip model can be upgraded in the future to meet the needs of more advanced communication systems. The product description and specific design requirements of the chip model are available in the product documentation, along with case studies and precautions that can be used to ensure the successful implementation of this chip model.
You May Also Be Interested In
4,539 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||