XCKU9P-3FFVE900E

The XCKU9P-3FFVE900E is a high-performance, low-power, FPGA-based chip model designed by Xilinx. It is based on the Kintex UltraScale+ architecture and is optimized for a wide range of applications.

The XCKU9P-3FFVE900E has a capacity of 3.2 million logic cells and is capable of delivering up to 2.6 TFLOPS of peak performance. It has a total of 1,536 DSP slices and offers up to 8.7 Gbps of transceiver bandwidth. It also features up to 4.2 GB of on-chip memory and up to 1.6 GB of off-chip memory.

The XCKU9P-3FFVE900E is suitable for a range of applications, including machine learning, video and image processing, and high-performance computing. It is also suitable for applications that require high-speed data transfer, such as 5G networks, automotive infotainment, and embedded vision systems.

The XCKU9P-3FFVE900E is available in a range of packages, including VFQFPN, FBGA, and TFBGA. It is also RoHS compliant and has a maximum operating temperature of 85°C.

Overall, the XCKU9P-3FFVE900E is a powerful, low-power FPGA-based chip model that is designed to meet the needs of a wide range of applications. It offers high performance, low power consumption, and a range of features that make it suitable for a variety of applications.