XCKU9P-1FFVE900E

The XCKU9P-1FFVE900E chip model is a field-programmable gate array (FPGA) manufactured by Xilinx, Inc. It is based on the 28nm UltraScale+ architecture and includes 9,152 logic cells, 9,152 flip-flops, 1,536 18Kb RAM blocks and 180 DSP slices. The device also features a total of 1,280 user I/O pins, with support for up to 16 high-speed transceivers. It has a maximum power dissipation of 11.5W and a maximum operating temperature of 100°C.

The XCKU9P-1FFVE900E is ideal for applications requiring high performance, low power consumption and flexibility. It is suitable for a wide range of applications, including high-speed networking, wireless communications, video processing, image processing, automotive, military, aerospace and medical systems.

The XCKU9P-1FFVE900E is designed for use in high-end applications, offering high-speed processing, low power consumption, and flexibility. It is equipped with a wide range of features, including high-speed transceivers, high-speed I/O, and low-power logic cells. It also features a rich set of development tools and IP cores, allowing for rapid prototyping and implementation.

In conclusion, the XCKU9P-1FFVE900E is a high-performance FPGA with a wide range of features and applications. It offers high-speed processing, low power consumption, and flexibility, making it ideal for a variety of applications.