XCKU3P-L1FFVD900I

The XCKU3P-L1FFVD900I is a high-performance, low-power field programmable gate array (FPGA) chip from Xilinx. It is based on the Kintex UltraScale architecture and offers up to 900K logic cells and up to 3.8Mb of block RAM. It also features up to 828 user I/Os, up to 904 DSP slices and 28 high-speed transceivers. The chip is designed for high-performance, low-power applications such as data centers, embedded systems, and industrial automation.

The XCKU3P-L1FFVD900I is built on a 28nm process technology and offers up to 2.5 GHz clock frequency. It has an integrated power management unit that allows for dynamic voltage and frequency scaling (DVFS) to reduce power consumption and extend battery life. It also features a wide range of I/O protocols, including PCIe, SATA, USB, and Ethernet. The chip supports a variety of design tools, including Vivado Design Suite, and is compatible with the Xilinx SDAccel, OpenCL and RTL development environments.

The XCKU3P-L1FFVD900I is suitable for applications such as image and video processing, high-speed networking, machine learning, and data analytics. It also supports the development of embedded systems, such as IoT devices, and can be used in a wide range of industrial automation applications. The chip is also ideal for applications that require high-performance computing, such as autonomous vehicles and robotics.

Overall, the XCKU3P-L1FFVD900I is a high-performance, low-power FPGA chip that is suitable for a wide range of applications. It offers high-speed transceivers, integrated power management, and a wide range of I/O protocols. It is also compatible with a variety of design tools, making it an ideal choice for embedded systems, industrial automation, and other applications that require high-performance computing.